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CEM-1 CEM/3 SMT PCB Assembly Hard PCBA cuircuit board Gold surface treatment

Shenzhen Shinelink Technology Ltd
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[China] country

Address: Room 201 Building A2 Industrial Park No. 6 Yuanchuang Park Rongfu road, Fucheng Street Longhua District Shenzhen City 518131

Contact name:Sandy

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Shenzhen Shinelink Technology Ltd

CEM-1 CEM/3 SMT PCB Assembly Hard PCBA cuircuit board Gold surface treatment

Country/Region china
City & Province shenzhen guangdong
Categories Electronics Production Machinery
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Product Details

CEM-1 CEM/3 PCB assembly, printed circuit board manufacturing

 

 

Quote requirement:

 

Gerber file of the bare PCB board

BOM (bill of material) for assembly

To short the lead time, please kindly advise us if there is any acceptable components substitution

Testing guide and test fixtures if necessary

Programming files and programming tool if necessary

Schematic if necessary

 

 

PCB capability and services:


1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)
2. Flexible PCB (up to 10 layers)
3. Rigid-flex PCB (up to 8 layers)
4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
7. Quantities range from prototype to volume production.
8. 100% E-Test

 

 

Shinelink kinds PCBA Products

 

 

 

Detail PCBA Capability

 

Turnkey PCBAPCB+components sourcing+assembly+package
Assembly detailsSMT and Thru-hole, ISO SMT and DIP lines
Lead TimePrototype: 15 work days. Mass order: 20~25 work days
Testing on productsFlying Probe Test, X-ray Inspection, AOI Test, Functional test
QuantityMin quantity: 1pcs. Prototype, small order, mass order, all OK
Files neededPCB: Gerber files(CAM, PCB, PCBDOC)
Components: Bill of Materials(BOM list)
Assembly: Pick-N-Place file
PCB Panel SizeMin size: 0.25*0.25 inches(6*6mm)
Max size: 20*20 inches(500*500mm)
PCB Solder TypeWater Soluble Solder Paste, RoHS lead free
Components detailsPassive Down to 0201 size
BGA and VFBGA
Leadless Chip Carriers/CSP
Double-sided SMT Assembly
Fine Pitch to 0.8mils
BGA Repair and Reball
Part Removal and Replacement
Component packageCut Tape,Tube,Reels,Loose Parts
PCB assembly
process
Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing
 

 

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