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UL ENIG copper circuit board Hard Drive PCB Boards turnkey service

Shenzhen Shinelink Technology Ltd
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Address: Room 201 Building A2 Industrial Park No. 6 Yuanchuang Park Rongfu road, Fucheng Street Longhua District Shenzhen City 518131

Contact name:Sandy

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Shenzhen Shinelink Technology Ltd

UL ENIG copper circuit board Hard Drive PCB Boards turnkey service

Country/Region china
City & Province shenzhen guangdong
Categories Other Computer Accessories
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Product Details

UL ENIG Heavy copper pcb Hard Drive PCB Boards turnkey service

 

Surface. Immersion Gold, Au thickness: min.2u"
Layer. 14Layer
Material. FR4, RoHS compliance
PCB Thickness. 1.6mm+/-10%
E-Test. 100%
Outgoing Reports:Final Inspection Report, E-Test Report, Solderability Test Report, Microsection Report and so on.
Inspection Standard:IPC-A-600H/IPC-6012B Class2 and IPC-A-600H/IPC-6012B class3
Certificates:UL, RoHS, ISO

 

Quick Leadtime


Lead time for sample
2-3 days for single-sided board
4-5 days for double-sided board
6-7 days for multilayer board
24-48 hours for urgent
Lead time or opening Mould:
3-5 days for normal mould
5-7 days for hard mould
Lead time for mass production
5-7 days for single/double sided board
7-10 days for multilayer board

 

What we need


1. Gerber files of the bare PCB
2. Bill of materials to include: Manufacturer's part number, type of part, type of packaging, component locations listed by reference designators and quantity
3. Dimensional specifications for non-standard components
4. Assembly drawing, including any change notices
5. Final test procedures (if available)

 

PCB Feature

 

Number of Layer1 - 20 Layer
Maximum Processing Area680 × 1000MM
Min Board Thickness2 Layer - 0.3MM ( 12 mil )
4 Layer - 0.4MM ( 16 mil )
6 Layer - 0.8MM ( 32 mil )
8 Layer - 1.0MM ( 40 mil)
10 Layer - 1.1MM ( 44 mil )
12 Layer - 1.3MM ( 52 mil )
14 Layer - 1.5MM ( 59 mil )
16 Layer - 1.6MM ( 63 mil )
18 Layer - 1.8MM ( 71 mil )
Finished Board Thickness ToleranceThickness ≤ 1.0MM, Tolerance: ± 0.1MM
1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%
Twisting and Bending≤ 0.75%, Min: 0.5%
Range of TG130 - 215 ℃
Impedance Tolerance± 10%, Min: ± 5%
Hi-Pot TestMax: 4000V/10MA/60S
Surface TreatmentHASL, With Lead, HASL Free Lead
Flash Gold, Immersion Gold
Immersion Silver, Immersion Tin
Gold Finger, OSP

 


PCBA capability and services SMT (Surface mounting technology), COB, DIP.
 

1. Material Sourcing Service
2. SMT assembly and Through hole components insertion
3. IC pre-programming / Burning on-line
4. Function testing as requested
5. Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc)
6. OEM/ODM also welcomed


Packing Terms


1. Inner packing. All the goods will be packed by vacuum
2. Outer packing. Standard carton

 

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