Specifications
1.Electeonic pcb assembly
2.high-class PCBA
3.superior service
4.professional technology
Producing Capability:
SMT pick and place chips more than 6 million point a day; AI DIP
more than 2 million pieces a day; Three lines of manual placement;
Two lines of testing; Two lines of assembly. These production lines
can meet the machining and assembly of various kinds of home
appliance, communication products, PC products.
Technology Ability:
Our Pick and Place machine can assemble fine pitch chips such as
0201 size chip; Multi-functional machine can match 0.3 pitch
packages such as QFP, BGA, uBGA, CSP and so on; DIP can match the
assembly of standing and lying parts and jumper. To cater for the
internationalization tendency, lead –free reflow solder machine and
wave solder machine have been introduced to our company in 2000,
meanwhile, we have put efforts on the research to the lead-free
solder tin and reflow curve and wave flow. Now we have abundant
practical experience on manufacture electronic products.