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8 Pin Overmolded Cable Assemblies Micro - Fit 3.0 Connector Off - The - Shelf (OTS)

Shenzhen Cablelinker Electronics Co., Limited
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Shenzhen Cablelinker Electronics Co., Limited

8 Pin Overmolded Cable Assemblies Micro - Fit 3.0 Connector Off - The - Shelf (OTS)

Country/Region china
City & Province shenzhen guangdong
Categories Wiring Harness
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Product Details

 

Overmolded 8 pin Molex Micro-Fit 3.0 Connector Off-the-Shelf (OTS) Overmold Cable Assembly

 

Product Description

Micro-Fit 3.0 Connector Systems, available in multiple circuit sizes and cable lengths for power and signal applications, offer a 3.00mm pitch, a 8.5A maximum current rating and many design options such as a terminal position assurance, blind-mating and compliant pin features

 

Specifications REFERENCE INFORMATION Packaging: UL File No.: E29179 CSA File No.: LR19980 Mates With: Micro-Fit* 3.0 Single-Row Plug (Series 43640) and Header (Series 43650); TPA Single-Row Receptacle (Series 171850) Micro-Fit* 3.0 Dual-Row Plug Housing (Series 43020) and Header TPA Dual-Row Receptacle (Series 172952) (Series 43045 and 44914) Terminal Used: Micro-Fit* 3.0 female crimp terminals (Series 43030 and 46235) Designed In: Millimeters RoHS: Yes Halogen Free: Yes (Non-Glow-Wire Versions) Glow Wire Compliant: Option Available, Contact Molex MECHANICAL Contact Insertion Force (max.): 14.7N per contact Contact Retention to Housing (min.): 24.5N Mating Force (max.): 8N per circuit Unmating Force (min.): 3.7N per circuit Durability (max.): typically 30 cycles, refer to product specifications PHYSICAL Housing: Nylon Contact: Various (Phosphor Bronze, Copper Alloy – see Product Specifications for Particular Connector System) Operating Temperature: -40 to +260°C ELECTRICAL Voltage (max.): 600V Current (max.): 5.0 to 8.5A (Please see product specifications; determined by terminal used) Contact Resistance (max.): 10 milliohms Dielectric Withstanding Voltage: <5mA Insulation Resistance (min.): 1,000 Megohms

 

Features and Benefits SMT, press-fit or surface mount compatible versions available Provides design flexibility. Offers options to meet many application needs Optional terminal position assurance (TPA) feature Reduces assembly error that results in terminal back-outs. Single row: one-piece design with integrated secondary lock. Dual row: two-piece TPA design Fitting nails and solderable clips available Offers header retention and strain relief options Fully isolated terminals Protect against potential damage of terminals during handling and mating High-temperature LCP headers Withstand 260˚C IR reflow processes Positive latching Ensures a reliable connection Fully polarized housings Prevents accidental mismating Micro-Fit BMI Connectors Micro-Fit (Compliant Pin) CPI Connectors Micro-Fit RMF (Reduced Mating Force) Terminals Blind-mating wire-to-wire and wire-to-board connectors Offers full range of options for every application and orientation Self-aligning feature molded into housings Allows up to 2.54mm misalignment Uses eye-of-the-needle press-fit design Provides a reliable connection Accepts standard Micro-Fit female and male crimp terminals Eliminates the need to purchase or inventory additional terminals

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