T275 VSSOP Temperature Sensor Chip TMP275AIDGKR TMP275AIDGKT

TMP275AIDGKR TMP275AIDGKT T275 VSSOP Temperature Sensor

TMP275 ±0.5°C Temperature Sensor With I2C and SMBus Interface in Industry Standard LM75 Form Factor and Pinout

 original stock

1 Feature

• High Accuracy:
– ±0.5°C (Maximum) From −20°C to 100°C
– ±1°C (Maximum) From −40°C to 125°C
• Low Quiescent Current:
– 50 μA (Typical)
– 0.1-μA Standby
• Resolution: 9 to 12 Bits, User-Selectable
• Digital Output: SMBus™, Two-Wire, and I
2C
Interface Compatibility
• 8 I
2C/SMBus Addresses
• Wide Supply Range: 2.7 V to 5.5 V
• Small VSSOP-8 and SOIC-8 Packages
• No Specified Power-up Sequence Required; TwoWire Bus Pullups May Be Enabled Before V+

2 Applications

• Power-Supply Temperature Monitoring
• Computer Peripheral Thermal Protection
• Battery Management
• Office Machines
• Servers
• Thermostat Controls
• Environmental Monitoring and HVAC
• Electromechanical Device Temperature
• Data Logger

3 Description

The TMP275 is a ±0.5°C accurate integrated digital
temperature sensor with a 12-bit analog-to-digital
converter (ADC) that can operate as low as 2.7-V
supply voltage and is pin- and register-compatible
with the Texas Instruments LM75, TMP75, TMP75B,
and TMP175 devices. This device is available in
SOIC-8 and VSSOP-8 packages, and it requires no
external components to sense the temperature. The
TMP275 is capable of reading temperatures with a
maximum resolution of 0.0625°C (12 bits) and as low
as 0.5°C (9 bits), which allows the user to maximize
efficiency by programming for higher resolution or
faster conversion time. The device is specified over a
temperature range of –40°C to 125°C.
The TMP275 device features SMBus and two-wire
interface compatibility, and allows up to eight devices
on the same bus with the SMBus overtemperature
alert function. The factory-calibrated temperature
accuracy and the noise-immune digital interface
make the TMP275 the preferred solution for
temperature compensation of other sensors and
electronic components, without the need for
additional system-level calibration or elaborate board
layout for distributed temperature sensing.