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Impedance Control Available Multilayer PCB Fabrication With Board Thickness 0.2 - 3.2mm

ShenZhen Jieteng Circuit Co., Ltd.

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Address: Building 1, Huafeng Science and Technology Park, No. 54 Guangtian Road, Luotian County community, Songgang Town, Bao'an District, Shenzhen City

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ShenZhen Jieteng Circuit Co., Ltd.

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Impedance Control Available Multilayer PCB Fabrication With Board Thickness 0.2 - 3.2mm

Country/Region china
City & Province shenzhen
Categories Passive Components
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Product Details

Product Description:

Multi-Layer PCB Fabrication is a comprehensive process for creating multi-level printed wiring boards. It involves the manufacture and assembly of multiple layers of conductive copper foil and other components between layers of insulating material. The process is highly specialized and requires precise engineering and production techniques to ensure the quality of the finished product.

The minimum line width for a multi-layer PCB is 0.1mm, supported by a wide range of silkscreen colors including white, black and yellow. A range of solder mask colors including green, blue, white, black and red are also available. The minimum hole size is 0.2mm and the minimum line spacing is also 0.1mm. These stringent parameters ensure that the multi-level printed wiring board is of extremely high quality.

Multi-Layer PCB Fabrication is a critical process in the development of many electronic products. It enables the creation of complex printed wiring boards in a range of sizes and forms for a variety of applications. By investing in this process, manufacturers are able to produce multi-level printed wiring boards of the highest quality.

 

Features:

  • Product Name: Multilayer PCB Fabrication
  • Board Thickness: 0.2-3.2mm
  • Solder Mask Color: Green, Blue, White, Black, Red, Etc.
  • Min. Hole Size: 0.2mm
  • Surface Finish: HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc.
  • Min. Line Width: 0.1mm
  • Multi-Level Printed Circuit Board Fabrication
  • Multi-Level Printed Wiring Board Creation
  • Multi-Level Printed Circuit Board Fabrication
 

Technical Parameters:

ParameterValue
Min. Hole Size0.2mm
MaterialFR4, High TG FR4, Halogen Free, Rogers, Etc.
Surface FinishHASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc.
Solder Mask ColorGreen, Blue, White, Black, Red, Etc.
Board Thickness0.2-3.2mm
Min. Line Width0.1mm
Copper Thickness1-4oz
Impedance ControlYes
Min. Line Spacing0.1mm
Silkscreen ColorWhite, Black, Yellow, Etc.
 

Applications:

JIETENG is a leading provider of multi-layer PCB fabrication services, providing customers with high-quality, cost-effective solutions. Our multi-level printed wiring board creation capabilities include a variety of materials, such as FR4, high TG FR4, halogen free, Rogers, etc. Our board thickness varies from 0.2 to 3.2mm, and we have the capacity to fabricate multi-layer printed circuit boards with 2 to 20 layers. We also provide impedance control and can ensure minimum hole size of 0.2mm.

Using cutting-edge equipment and the latest techniques, JIETENG is able to provide superior multi-level printed circuit board fabrication services. Our experienced engineers are well-versed in the design and production of multi-layer printed circuit boards, and we are dedicated to providing the highest quality products and services to our customers. We are committed to meeting the needs of our customers, and we are confident that our multi-layer PCB fabrication services will meet and exceed all expectations.

We understand the importance of quality assurance, and all of our multi-layer printed circuit boards are rigorously tested before they are shipped to customers. Our commitment to quality and customer service has earned us a reputation as one of the leading providers of multi-level printed wiring board creation services. We strive to provide the best products and services to meet all of our customers’ needs, and we are confident that our multi-layer printed circuit board fabrication services will exceed your expectations.

 

Customization:

JIETENG Multi-Layer Printed Circuit Board Production

Brand Name: JIETENG
Model Number: PCB circuit board
Place of Origin: China
Solder Mask Color: Green, Blue, White, Black, Red, Etc.
Surface Finish: HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc.
Layer Count: 2-20
Material: FR4, High TG FR4, Halogen Free, Rogers, Etc.
Board Thickness: 0.2-3.2mm

JIETENG provides multi-layer printed circuit board production and component assembly. Our products are designed to meet customer specifications and needs. From two to twenty layers, you can customize the PCB thickness, solder mask color, surface finish, and material. We offer FR4, high TG FR4, halogen free, and Rogers materials. Our surface finishes include HASL, ENIG, OSP, immersion silver, and immersion tin. All of our products are manufactured with quality and accuracy in mind.

JIETENG is dedicated to producing high quality multi-layer printed circuit boards and components for our customers. We have a team of experienced engineers and technicians who specialize in PCB design and production. With our expertise and advanced production technology, we are confident that your multi-layer PCB needs will be met.

Contact us today to get a quote for your multi-layer printed circuit board production and component assembly needs.

 

Support and Services:

Multilayer PCB Fabrication offers complete technical support and service for our products.

Our technical support team is available to answer your questions and provide assistance with any product-related issues. We provide technical support via phone, email, and online chat. Our technical support team is knowledgeable in all aspects of the product and can provide assistance with installation, configuration, and troubleshooting.

We also offer a full range of services, such as engineering services, prototyping services, and manufacturing services. We strive to deliver the highest quality products and services to our customers.

If you have any questions or need assistance with any of our products, please do not hesitate to contact us.

 

Packing and Shipping:

Packaging and Shipping for Multilayer PCB Fabrication

Packaging and shipping for multilayer PCB fabrication consists of the following steps:

  1. Inspect the PCBs for quality and accuracy.
  2. Pack the PCBs in ESD-safe packaging.
  3. Label the package with the customer’s information and shipping address.
  4. Ship the package.
 

FAQ:

Q&A for Multilayer PCB Fabrication
  • Q: What is the Brand Name for Multilayer PCB Fabrication?
    A: The Brand Name for Multilayer PCB Fabrication is JIETENG.
  • Q: What is the Model Number for Multilayer PCB Fabrication?
    A: The Model Number for Multilayer PCB Fabrication is PCB circuit board.
  • Q: Where is the Place of Origin for Multilayer PCB Fabrication?
    A: The Place of Origin for Multilayer PCB Fabrication is China.
  • Q: What are the features of Multilayer PCB Fabrication?
    A: The features of Multilayer PCB Fabrication include high speed, low noise, long service life, good stability, and high accuracy.
  • Q: What are the applications of Multilayer PCB Fabrication?
    A: The applications of Multilayer PCB Fabrication include automotive, medical, robotics, aerospace, and consumer electronics.

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