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TO8 Header Encapsulated Components Transistor Outline Package

JOPTEC LASER CO., LTD

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Address: No.451 Huangshan Road, Hefei, Anhui, China

Contact name:JACK HAN

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TO8 Header Encapsulated Components Transistor Outline Package

Country/Region china
City & Province hefei anhui
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Product Details

Product name:Sealed enclosure alloy package for circuit
Finish:Fully plating Au or selective plating Au.
Plating coating:Plate and lead plating Ni:4-11.43um,plating Au:1.0-1.3um. Cap plating Ni:4-11.43um.
Product formation:MaterialQuantity
1. Cap10#Steel1
2. Welding ringHLAgCu281
3. Lead 14J29(Kovar)1
4. Glass insulatorBH-G/K3
5. Lead 24J29(Kovar)3
6. Bottom floor4J29(Kovar)1
Insulation resistance500V DC resistance between single glass sealed pin and shell is ≥1*1010Ω
HermeticityLeak rate is ≤1*10-3Pa.cm3/s
Product features:1. Shell adopt material:FeNiCo,FeNi42 or CRS;
2. The shape of pin is cyclinder and straight,material adopts Kovar.
3. The sealing cap method is percussion welding or tin welding.

4. The rank of pin which cross the bottom of base could be choosen

by customers.

5. The position of ground pin can be choosen by customer.
6. The design of caps need to fit the shell.
7. Customer could choose shell fully plating or pin selective plating.

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