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Customized Black ESD Jedec IC Trays Ultrasonic Cleaning For PCBA Module

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Address: Building A11,Zone D,West Industrial Zone,Minzhu Community, Date: 2022-7-15 Shajing Street,Baoan District,Shenzhen City,GD Province CN

Contact name:Rainbow Zhu

Shenzhen Hiner Technology Co.,LTD

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Customized Black ESD Jedec IC Trays Ultrasonic Cleaning For PCBA Module

Country/Region	china
City & Province	shenzhen guangdong
Categories	Other Plastic Products

Product Details

Customized Black ESD Jedec IC Trays Ultrasonic Cleaning For PCBA Module

PPE Jedec Trays With Different Cavity Can Be Customized For PCBA

Quick Description:

Outline Line Size	322.6135.97.62mm	Brand	Hiner-pack
Model	HN 18102	Package Type	PCBA
Cavity Size	35353.05mm	Matrix QTY	3*7=21PCS
Material	PPE	Flatness	MAX 0.76mm
Color	Black	Service	Accept OEM,ODM
Resistance	1.0x10e4-1.0x10e11Ω	Certificate	ROHS

1. Standard Jedec Tray Outline size is 322.6X135.9X7.62mm or 322.6*135.9*12.19mm.

2. The production process is injection molded products.

3. Rich experience and mature design team in the field of injection molding products, providing one-stop services from design to mold to product packaging

While the Jedec Tray is widely used in the semiconductor industry, the PCB module market is slowly recognizing and using custom trays to transport and load modules, because it can not only fully meet customer requirements in terms of performance, but also match the market demand for high-end modules. The IC Tray has been fully recognized in different industries.We have accumulated a wealth of experience in loading different IC and modules, and have produced many similar series of trays.

Product Application

Package IC PCBA module component

Electronic component packaging Optical device packaging

Packaging

Packaging Details:Packing according to customer's specified size

Reference to temperature resistance of different materials

Material	Bake Temperature	Surface Resistance
PPE	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
MPPO+Carbon Fiber	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
MPPO+Carbon Powder	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
MPPO+Glass Fiber	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
PEI+Carbon Fiber	Max 180°C	1.010E4Ω~1.010E11Ω
IDP Color	85°C	1.010E6Ω~1.010E10Ω
Color, temperature and other special requirements can be customized

FAQ

1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whatsapp, in case of any delays.

2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.

3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.

5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.