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9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics

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9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics

City & Province	shanghai shanghai
Categories	Other Chemical Auxiliaries

Product Details

9504 TDS-EN.pdf

9504 One-Component Pre-Curing Type Thermal Gel, which has no residual stress after sizing, effectively protects precision electronic components from damage

Product Description

Pink paste gel
One-part pre-curing type
Silicone thermal conductivity complex

Product Features:

High thermal conductivity 4W/m∙K
Very small BLT and very low thermal resistance
Soft adhesion and self-adhesive properties after dispensing
Excellent chemical and mechanical stability
No residual stress after sizing, effectively protects precision electronic components from damage

Technical Parameters

Reference standard	Item	Unit	Value
GB/T 13354	Density	g/cm³	3.2
--	Extrusion rate (30ccEFD@90psi)	g/min	30
ISO22007	Thermal conductivity	W/ m·K	4.0
GB/T2408	Flame retardant	/	V0
GB/T2408	Volume resistivity	Ω·cm	≥1.0×10¹³
ASTM D149	Dielectric strength	Kv/mm	8.0
ASTM D5470	Minimum thickness	mm	0.1

Main Applications:

Bare die chip low-stress mounting
Heat dissipation field of 5G communication boards
Automotive electronic equipment
Smart phone modules and consumer-electronics
Other high-value boards need to be reworked

Packing:

30cc/tube; 300cc/tube

Storage:

Store below 35°C in a cool and dry place.

Shelf life is 6 months.

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