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Two component epoxy adhesive , yellow green high toughness a and b epoxy Glue

Shanghai Huitian New Material Co., Ltd

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Two component epoxy adhesive , yellow green high toughness a and b epoxy Glue

City & Province shanghai shanghai
Categories Adhesives & Sealants
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Product Details

6169 wind blade structural adhesive is a two component epoxy adhesive, high-thixotropic, light green, high toughness, high strength epoxy adhesive.

 

Characteristics before curing
Typical values range
A component
Appearance light yellow high thixotropic paste
Chemical Composition modified epoxy resin
Density 23℃(GB/T 15223-2008) 1.27
Viscosity (mPa.s) (GB/T 22314-2008) 413000
B component
Appearance light blue thixotropic paste
Chemical Composition modified amine
Density 23℃(GB/T 15223-2008) 1.28
Viscosity (mPa.s) (GB/T 22314-2008) 300000
Mixing characteristics
Appearance light green thixotropic paste
weight ratio A:B=100:50 A:B=100:50±2
Operation time (min, 23℃) 30
(DIN 16945-1989)
Curing time (day, 25℃) 7
Characteristics after curing(23℃, 50%RH)

Shear strength (MPa, FRP) (GB/T 7124-2008)
3mm 14.6
0.5mm 25.1
Tensile strength (body, 23℃, MPa)
(ISO 527-2:1993) 44
The tensile modulus (body, 23℃,GPa)
(ISO 527-2:1993) 2.82

Use Instructions
Surface preparation: directly used for non porous material. porous or absorbent surfaces should be filled
with a mixture of liquid resin.
Mixing: mix with weight ratio of A:B=100:50, the increase or decrease outside the allowance in the amount of curing agent will accelerate or reduce the rate of curing, leading to incompletely curing. This can not be modified again. A and B must be mixed very evenly, until no turbidity is visible. Yellow A and blue B can be visually recognized. Special attention should be paid to the bottom and wall of the mixing vessel. It is very difficult to mix a lot of glue by hand because of the high viscosity. Mixing equipment is necessary to ensure a larger amount of glue for industrial use.
Curing: the mixture should be carried out in 20-30℃, the surface temperature of the material is no higher than 35℃. Before curing, remove excess adhesive from the surface. In curing process, the components should be heated slowly so that the internal stress of the material should be controlled to the minimum. If curing thickness is over 10mm, use periodic heating considering the concentration of heat release. Set procedures by testing the temperature of the center

 

 

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