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Chip Integrated Circuit Inductor 10uH , High Current smd power inductor

Shenzhen Fuchangwei Technology Co., Ltd
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Address: 5th Floor, Building D4, Huitong Industrial Park, Hongye Middle Road, Yongtou Community, Chang'an Town, Dongguan,Guandong,China.

Contact name:Connie Zheng

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Shenzhen Fuchangwei Technology Co., Ltd

Chip Integrated Circuit Inductor 10uH , High Current smd power inductor

Country/Region china
City & Province dongguan
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Product Details

Molding Power Choke SMD Inductors Chip Integrated Circuit Inductor High Current alloy powder

SMD Power Inductor Original Smd Alloy Powder Molded Chip Integrated Circuit Ic 1.0uH~4.7uH

Molding Power Choke SMD Inductors Chip Integrated Circuit Inductor High Current Alloy Powder

 

Features:

  • Magnetically shielded construction, low DC resistance;
  • The use of magnetic iron powder ensure capability for large current;
  • Low audible core noise;
  • Ideal for DC-DC converter applications in hand held personal computer and etc;
  • Handles high transient current spikes without saturation
  • Ultra low buzz noise, due to composite construction
  • Ultra-thin size, can be applied to MINI products
  • Small tolerance, no heat generation, convenient production

Applications:

  • Smart phone,MID;
  • Next-generation mobile devices with multifunction such as adding color TV and digital movie cameras;
  • Flat-screen TVs, blue-ray disc recorders, set top box;
  • Notebooks, desktop computers, servers, graphic cards;
  • Portable gaming devices, personal navigation systems, personal multimedia devices;
  • Automotive systems;
  • Bluetooth Products

Specification:

 

temDescription
CategoryMolding Power Inductor
Inductance0.10uH~10uH 
Current Rating (Amps)40A~6.0A
Size / Dimension7.1*6.6*2.4mm
Materialalloy powder

 

Dimensions

Specification

 

Packaging Information:

 

NOTES:

  • DC current (Idc) that will cause an approximate △T of 40℃
  • DC current (Isat) that will cause Lo to drop approximately 20%
  • All test data is referenced to 25℃ ambient
  • Operating Temperature Range -55℃ to +120℃
  • The part temperature (ambient + temp rise) should not exceed 120℃ under the worst operating conditions. 
  • Circuit design, component placement, PWB trace size and thickness, airflow and other cooling provisions                                         
  • all affect the part temperature. Part temperature should be verified in the end application.

Packaging Quantity(pcs)

 

 

 

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