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TMS320VC5409APGE16 Digital Signal Processor IC DSP Integrated Circuits QFP144

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TMS320VC5409APGE16 Digital Signal Processor IC DSP Integrated Circuits QFP144

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Product Details

TMS320VC5409APGE16 Digital Signal Processors DSP Integrated Circuits QFP144 Texas Instruments ICs

 

Description:

 

The TMS320VC5409A fixed-point, digital signal processor (DSP) (hereafter referred to as the 5409A
unless otherwise specified) is based on an advanced modified Harvard architecture that has one program
memory bus and three data memory buses. This processor provides an arithmetic logic unit (ALU) with a
high degree of parallelism, application-specific hardware logic, on-chip memory, and additional on-chip
peripherals. The basis of the operational flexibility and speed of this DSP is a highly specialized instruction
set.


Separate program and data spaces allow simultaneous access to program instructions and data, providing
a high degree of parallelism. Two read operations and one write operation can be performed in a single
cycle. Instructions with parallel store and application-specific instructions can fully utilize this architecture.
In addition, data can be transferred between data and program spaces. Such parallelism supports a
powerful set of arithmetic, logic, and bit-manipulation operations that can all be performed in a single
machine cycle. The 5409A also includes the control mechanisms to manage interrupts, repeated
operations, and function calls.

 

Specification:Fixed-Point Digital Signal Processor IC

Part numberTMS320VC5409APGE16
Category
Integrated Circuits (ICs)
 
Embedded - DSP (Digital Signal Processors)
Mfr
Texas Instruments
Series
TMS320C54x
Package
Tray
Part Status
Active
Type
Fixed Point
Interface
Host Interface, McBSP
Clock Rate
160MHz
Non-Volatile Memory
ROM (32kB)
On-Chip RAM
64kB
Voltage - I/O
3.30V
Voltage - Core
1.60V
Operating Temperature
-40°C ~ 100°C (TC)
Mounting Type
Surface Mount
Package / Case
144-LQFP
Supplier Device Package
144-LQFP (20x20)
Base Product Number
TMS320

 

Features:

Advanced Multibus Architecture With Three Parallel Load Separate 16-Bit Data Memory Buses and One

• Conditional Store Instructions Program Memory Bus

• Fast Return From Interrupt

• 40-Bit Arithmetic Logic Unit (ALU) Including a

• On-Chip Peripherals 40-Bit Barrel Shifter and Two Independent – Software-Programmable Wait-State 40-Bit Accumulators Generator and Programmable

• 17- × 17-Bit Parallel Multiplier Coupled to a Bank-Switching 40-Bit Dedicated Adder for Non-Pipelined – On-Chip Programmable Phase-Locked Single-Cycle Multiply/Accumulate (MAC) Loop (PLL) Clock Generator With Internal Operation Oscillator or External Clock Source(1) • Compare, Select, and Store Unit (CSSU) for the – One 16-Bit Timer Add/Compare Selection of the Viterbi Operator – Six-Channel Direct Memory Access (DMA) Controller

• Exponent Encoder to Compute an Exponent Value of – Three Multichannel Buffered Serial Ports a 40-Bit Accumulator Value in a (McBSPs) Single Cycle – 8/16-Bit Enhanced Parallel Host-Port

• Two Address Generators With Eight Auxiliary Interface (HPI8/16) Registers and Two Auxiliary Register

• Power Consumption Control With IDLE1, Arithmetic Units (ARAUs) IDLE2, and IDLE3 Instructions With

• Data Bus With a Bus Holder Feature Power-Down Modes • Extended Addressing Mode for 8M × 16-Bit

• CLKOUT Off Control to Disable CLKOUT Maximum Addressable External Program

• On-Chip Scan-Based Emulation Logic, IEEE Space Std 1149.1 (JTAG) Boundary Scan Logic (2)

• 32K × 16-Bit On-Chip RAM Composed of: • 144-Pin Ball Grid Array (BGA) (GGU Suffix) – Four Blocks of 8K × 16-Bit On-Chip Dual-Access Program/Data RAM

• 144-Pin Low-Profile Quad Flatpack (LQFP) (PGE Suffix) • 16K × 16-Bit On-Chip ROM Configured for Program Memory

• 6.25-ns Single-Cycle Fixed-Point Instruction Execution Time (160 MIPS) • Enhanced External Parallel Interface (XIO2)

• 8.33-ns Single-Cycle Fixed-Point Instruction

• Single-Instruction-Repeat and Block-Repeat Operations Execution Time (120 MIPS) for Program Code

• 3.3-V I/O Supply Voltage (160 and 120 MIPS)

• Block-Memory-Move Instructions for Better Program and Data Management

• 1.6-V Core Supply Voltage (160 MIPS)

• Instructions With a 32-Bit Long Word Operand

• 1.5-V Core Supply Voltage (120 MIPS) (1) The on-chip oscillator is not available on all 5409A devices.

 

 

 

Related products:

 

DEVICE OPTION PACKAGE FREQUENCY RATED CURRENT OUTPUT VOLTAGE

LMR33630ADDA DDA (8-pin HSOIC) 5 × 4 mm 400 kHz 3 A

LMR33630BDDA 1400 kHz 3 A Adjustable 

LMR33630CDDA 2100 kHz 3 A

LMR33630ARNX RNX (12-pin VQFN) 3 × 2 × 0.85 mm 400 kHz 3 A

LMR33630BRNX 1400 kHz 3 A Adjustable LMR33630CRNX 2100 kHz 3 A

 

All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LMR33630ADDAR SO PowerPAD DDA 8 2500 366.0 364.0 50.0

LMR33630ARNXR VQFN-HR RNX 12 3000 213.0 191.0 35.0

LMR33630ARNXR VQFN-HR RNX 12 3000 210.0 185.0 35.0

LMR33630ARNXT VQFN-HR RNX 12 250 210.0 185.0 35.0

LMR33630ARNXT VQFN-HR RNX 12 250 213.0 191.0 35.0

LMR33630BDDAR SO PowerPAD DDA 8 2500 366.0 364.0 50.0

LMR33630BRNXR VQFN-HR RNX 12 3000 213.0 191.0 35.0

LMR33630BRNXR VQFN-HR RNX 12 3000 210.0 185.0 35.0

LMR33630BRNXT VQFN-HR RNX 12 250 213.0 191.0 35.0

LMR33630BRNXT VQFN-HR RNX 12 250 210.0 185.0 35.0

LMR33630CDDAR SO PowerPAD DDA 8 2500 366.0 364.0 50.0

LMR33630CRNXR VQFN-HR RNX 12 3000 213.0 191.0 35.0

LMR33630CRNXR VQFN-HR RNX 12 3000 210.0 185.0 35.0

LMR33630CRNXT VQFN-HR RNX 12 250 210.0 185.0 35.0

LMR33630CRNXT VQFN-HR RNX 12 250 213.0 191.0 35.0

 

 

 

 

 

 

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