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[China]
Trade Verify
Address: Fl12,Tower E XingHe World LongHua District Shenzhen China 518000
Contact name:Sophia
Angel Technology Electronics Co |
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Verified Suppliers
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HAL lead free pcb + Blue peelable mask print circuits pcb for Consumer Electronics products
Our PCB are widely used in smart electronics, communications Technology, power technology, industrial control,
security engineering, automotive industry, medical control and optoelectronic engineering and other fields.
Our circuits boards range from double layers to 24 layers.
The product types include ordinary boards, medium and high Tg boards, involving special processes such as semi-hole,
bonding, impedance, blue glue, carbon oil, gold fingers, blind gongs, buried blind holes , Countersunk holes, etc.;
surface treatment can be ordinary tin spray, lead-free tin spray, immersion gold, electro-nickel gold, electro-hard gold,
QSP, immersion silver, immersion tin or composite processes, etc..
Our PCB factory is fully qualified and has passed a series of certifications including UL, ISO9001, ISO14001,
ISO/TS16949, CQC and so on.
Please provide your gerber file and bom list for getting one-stop service.
Quote Requirement:
*Gerber file of the bare PCB board.
*BOM (Bill of material) for assembly.
*To short the lead time, please kindly advise us if there is any acceptable components substitution.
*Testing Guide & Test Fixtures if necessary.
Specification:
| Base Material | FR4 |
| Permittivity | 4.3 |
| Layer(s) | 2(Doubles) |
| Board Thickness | 1.6mm |
| Outer copper thickness | 1oz |
| Inner copper thickness | NON |
| Mounting Type | Immersion gold |
| Min Hole Diameter | 0.3mm |
| Minimum line width | 0.3mm |
| (MLI)Min Line Spacing | 0.3mm |
| Application | Consumer Electronics products |
| Characteristic | HAL lead free pcb + Blue peelable mask |
| Packaging Details | Inner: vacuum packing or Anti-static package, Outer: export carton or according to the customer's requirement. |
Images:
PCB Assembly Capabilities | ||
| Item | Technical Parameter | |
| SMT Jointing Min. Space | 0201mm | |
| QFP Space | Pitch 0.3mm | |
| Min. Package | 0201 | |
| Min. Size | 2*2 inch(50*50mm) | |
| Max. Size | 14*22 inch(350*550mm) | |
| Placement Precision | ±0.01mm | |
| Placement Precision | QFP, SOP, PLCC, BGA | |
| Placement Capability | 0805, 0603, 0402, 0201 | |
| PCB Lead time (workday(s)) Normally | |||||
| Single, Double-sided | 4 layer | 6 layer | Over 8 layer | HDI | |
| Sample Lead time (Normal) | 5-6 | 6-7 | 7-8 | 10-12 | 10-12 |
| Sample Lead time (Faster) | 48-72 hours | 5 | 6 | 6-7 | 12 |
| Mass production lead time | 7-9 | 10-12 | 13-15 | 16 | 20 |
| PCB Assembly Lead time | |||||
| Sample Lead time | PCB Fab+Components preparation +PCBA=15 workdays | ||||
| Mass production lead time | PCB Fab+Components preparation +PCBA=21workdays | ||||
