Active Member
|
[China]
Address: 803 Chevalier House, 45-51 Chatham Road South, Tsim Sha Tsui, Kowloon, Hong Kong
Contact name:Natalie Xue
Bicheng Technologies Limited |
|
|
Low Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872 Multilayer PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
TU-872 SLK Sp is based on a high performance modified epoxy FR-4 resin. This material is reinforced with
novel woven glass and designed with extra low dielectric constant and low dissipation factor for high speed
low loss and high frequency circuit board application. TU-872 SLK Sp material is suitable for environmental
protection lead free process and also compatible with FR-4 processes. TU-872 SLK Sp laminates also exhibit
excellent CTE, superior chemical resistance, moisture resistance, thermal stability, CAF resistance and toughness
enhanced by an allyl network forming compound.
Key Features
1. Excellent electrical properties
2. Dielectric constant less than 3.5
3. Dissipation factor less than 0.010
4. Excellent, stable and flat Dk/Df performance
5. Compatible with most FR-4 processes
6. Lead free process compatible
7. Improved z-axis thermal expansion
8. Anti-CAF capability
9. Superior dimensional stability, thickness uniformity and flatness
10. Excellent through-hole and soldering reliability
Our PCB Capabilities (TU-872 SLK Sp)
| PCB Material: | High performance modified epoxy FR-4 resin |
| Designation: | TU-872 SLK Sp |
| Dielectric constant: | < 3.5 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm) |
| PCB thickness: | 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 60mil(1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc.. |
| Technology: | HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc. |
Main Applications
1. Radio Frequency
2. Backpanel, High performance computing
3. Line cards, Storage
4. Servers, Telecom, Base station
5. Office Routers
Our Advantages
ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;
16000㎡ workshop;
30000㎡ output capability per month;
Prototype to large volume production capability
IPC Class 2 / IPC Class 3;
Any layer HDI PCBs;
Delivery on time: >98%
Customer complaint rate: <1%
Typical Properties (TU-872 SLK Sp)
| Typical Values | Conditioning | IPC-4101 /126 | |
| Thermal | |||
| Tg (DMA) | 220°C | ||
| Tg (DSC) | 200°C | > 170°C | |
| Tg (TMA) | 190°C | E-2/105 | |
| Td (TGA) | 340°C | > 340°C | |
| CTE x-axis | 12~15 ppm/°C | N/A | |
| CTE y-axis | 12~15 ppm/°C | E-2/105 | N/A |
| CTE z-axis | 2.30% | < 3.0% | |
| Thermal Stress,Solder Float, 288°C | > 60 sec | A | > 10 sec |
| T260 | 60 min | > 30 min | |
| T288 | 20 min | E-2/105 | > 15 min |
| T300 | 5 min | > 2 min | |
| Flammability | 94V-0 | E-24/125 | 94V-0 |
| DK & DF | |||
| Permittivity (RC 50%) @10GHz | 3.5 | ||
| Loss Tangent (RC 50%) @10GHz | 0.008 | ||
| Electrical | |||
| Permittivity (RC50%) | |||
| 1GHz (SPC method/4291B) | 3.6/3.4 | < 5.2 | |
| 5GHz (SPC method) | 3.5 | E-2/105 | - |
| 10GHz (SPC method) | 3.5 | - | |
| Loss Tangent (RC50%) | |||
| 1GHz (SPC method/4291B) | 0.006/0.004 | ||
| 5GHz (SPC method) | 0.007 | E-2/105 | < 0.035 |
| 10GHz (SPC method) | 0.008 | ||
| Volume Resistivity | > 1010 MΩ•cm | C-96/35/90 | > 106 MΩ•cm |
| Surface Resistivity | > 108 MΩ | C-96/35/90 | > 104 MΩ |
| Electric Strength | > 40 KV/mm | A | > 30 kV/mm |
| Dielectric Breakdown | > 50 kV | A | N/A |
| Mechanical | |||
| Young’s Modulus | |||
| Warp Direction | 26 GPa | A | N/A |
| Fill Direction | 24 GPa | ||
| Flexural Strength | |||
| Lengthwise | > 60,000 psi | A | > 60,000 psi |
| Crosswise | > 50,000 psi | A | > 50,000 psi |
| Peel Strength, 1.0 oz RTF Cu foil | 4~7 lb/in | A | > 4 lb/in |
| Water Absorption | 0.13% | E-1/105+D-24/23 | < 0.5 % |
