Active Member
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[China]
Address: No.5 Building, No.581 Heilong Jiang Road, Li Yu Industrial Park, Tian Yuan District, Zhuzhou, Hunan, P.R. China.
Contact name:Wu
Zhuzhou Jiabang Refractory Metal Co., Ltd |
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Copper Tungsten (WCu/CuW) / Molybdenum Copper (MoCu/CuMo) / Copper
Molybdenum Electronic Packaging Materials
Description:
Copper Tungsten are composites of tungsten and copper. By adjusting the content of
tungsten, we can have its coefficient of thermal expansion (CTE)
designed to match those of materials such as ceramics (Al2O3, BeO),
semiconductors (Si), and metals (Kovar), etc.
Molybdenum copper alloy is a composite material of molybdenum and
copper which has adjustable coefficient of thermal expansion and
thermal conductivity. But the density of molybdenum copper is much
smaller than tungsten copper.Therefore, molybdenum copper alloy is
more suitable for aerospace and other fields.
Advantages:
1. High thermal conductivity
2. Excellent hermeticity
3. Stampable sheets available
4. Semi-finished or finished (Ni/Au/Ag/NiPd/Au plated)
products available
5. Low void
Product Properties:
| Grade | W Content | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
| 90WCu | 90±2% | 17.0 | 6.5 | 180 (25℃) /176 (100℃) |
| 85WCu | 85±2% | 16.4 | 7.2 | 190 (25℃) / 183 (100℃) |
| 80WCu | 80±2% | 15.65 | 8.3 | 200 (25℃) / 197 (100℃) |
| 75WCu | 75±2% | 14.9 | 9.0 | 230 (25℃) / 220 (100℃) |
| 50WCu | 50±2% | 12.2 | 12.5 | 340 (25℃) / 310 (100℃) |
| Grade | Mo Content | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
| 85MoCu | 85±2% | 10.0 | 7 | 160(25℃)/156(100℃) |
| 70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
| 60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
| 50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Application:
Our products are widely used in applications such as heat sink,
heat spreader, shim, laser diode submount, substrates, base plate,
flange, chip carrier, optical bench, etc.
Product picture:
