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4 Layer Pcb Assembly Circuit Board With Rogers 4350 Core 4450 Prepreg

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4 Layer Pcb Assembly Circuit Board With Rogers 4350 Core 4450 Prepreg

Country/Region china
City & Province foshan
Categories Electronic Accessories & Supplies
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Product Details

4 Layer Multilayer Pcb Assembly Circuit Board With Rogers 4350 Core 4450 Prepreg

 

 

PCB parameter:

 

Material:Rogers 4350  0.254mm

Board size:160*180mm

Surface finish:Immersion gold

Copper weight:1OZ

Solder mask:Green

Silk screen:White

 

Mulilayer pcb introduction:.

 

A multilayer PCB (Printed Circuit Board) is a type of circuit board that consists of multiple layers of conductive traces, insulating material, and vias. It is commonly used in electronic devices where high-density and complex circuitry is required.

In a multilayer PCB, the conductive traces are typically made of copper and are etched onto the layers of the board. The insulating material, usually referred to as the substrate or core, is made of materials like fiberglass-reinforced epoxy resin (FR-4). The layers of conductive traces and insulating material are stacked on top of each other and bonded together under heat and pressure.

The layers are interconnected using vias, which are small plated-through holes that allow electrical connections between different layers of the PCB. Vias can be either through-hole vias or blind/buried vias. Through-hole vias span all layers of the board, while blind vias connect an outer layer to one or more inner layers, and buried vias connect two or more inner layers without reaching the outer layers.

Multilayer PCBs offer several advantages over single-layer or double-layer PCBs. They allow for a higher density of components and interconnections, reducing the size and weight of the overall circuit. They also provide better signal integrity by reducing electromagnetic interference (EMI) and noise. Additionally, multilayer PCBs can offer improved thermal management by allowing the distribution of heat across multiple layers.

The design and manufacturing of multilayer PCBs require specialized software and processes. The design process involves creating multiple layers with appropriate copper traces and vias, as well as defining the stack-up and layer order. The fabrication process involves laminating and bonding the layers together, drilling vias, plating them, and then etching the conductive traces.

Overall, multilayer PCBs are widely used in a variety of applications, including smartphones, computers, automotive electronics, aerospace systems, and many other electronic devices that require compactness, high performance, and reliability.

 

There are several kinds of multilayer PCBs that are used in different applications. Here are some common types:

 

Standard Multilayer PCB: This is the most basic type of multilayer PCB, typically consisting of four to eight layers. It is widely used in general electronic devices and applications where moderate complexity and density are required.

High-Density Interconnect (HDI) PCB: HDI PCBs are designed to provide higher component density and finer traces than standard multilayer PCBs. They often have microvias, which are very small diameter vias that allow for more interconnections in a smaller space. HDI PCBs are commonly used in smartphones, tablets, and other compact electronic devices.

Flex and Rigid-Flex PCB: These types of multilayer PCBs combine flexible and rigid sections into a single board. Flex PCBs use flexible materials like polyimide, while rigid-flex PCBs incorporate both flexible and rigid sections. They are used in applications where the PCB needs to bend or conform to a specific shape, such as in wearable devices, medical equipment, and aerospace systems.

Sequential Lamination PCB: In sequential lamination PCBs, the layers are laminated together in separate groups, allowing for a higher number of layers. This technique is used when a large number of layers, such as 10 or more, are required for complex designs.

Metal Core PCB: Metal Core PCBs have a layer of metal, usually aluminum or copper, as the core layer. The metal core provides better heat dissipation, making them suitable for applications that generate a significant amount of heat, such as high-power LED lighting, automotive lighting, and power electronics.

RF/Microwave PCB: RF (Radio Frequency) and microwave PCBs are designed specifically for high-frequency applications. They use specialized materials and manufacturing techniques to minimize signal loss, impedance mismatch, and electromagnetic interference. RF/Microwave PCBs are commonly used in wireless communication systems, radar systems, and satellite communications.

 

Multilayer pcb application:

 

Multilayer PCBs find application across various industries and electronic devices where complex circuitry, high density, and reliability are required. Some common applications of multilayer PCBs include:

Consumer Electronics: Multilayer PCBs are extensively used in consumer electronic devices such as smartphones, tablets, laptops, gaming consoles, televisions, and audio systems. These devices require compact designs and high-density interconnections to accommodate numerous components.

Telecommunications: Multilayer PCBs play a crucial role in telecommunications equipment, including routers, switches, modems, base stations, and network infrastructure. They enable efficient signal routing and facilitate the high-speed data transmission required in modern communication systems.

Automotive Electronics: Modern vehicles incorporate a wide range of electronics for functions like engine control, infotainment systems, advanced driver-assistance systems (ADAS), and telematics. Multilayer PCBs are used to accommodate the complex circuitry and ensure reliable performance in automotive environments.

Industrial Equipment: Multilayer PCBs are utilized in industrial equipment such as control systems, robotics, automation systems, and manufacturing machinery. These PCBs provide the necessary interconnections for precise control and monitoring of industrial processes.

Aerospace and Defense: The aerospace and defense industries rely on multilayer PCBs for avionics systems, radar systems, communication equipment, guidance systems, and satellite technology. These applications demand high reliability, signal integrity, and resistance to harsh environments.

Medical Devices: Medical devices and equipment, including diagnostic tools, imaging systems, patient monitoring devices, and surgical instruments, often utilize multilayer PCBs. These PCBs enable the integration of complex electronics and assist in accurate and reliable medical diagnostics and treatments.

Power Electronics: Multilayer PCBs are employed in power electronics applications, such as inverters, converters, motor drives, and power supplies. They help manage high currents, heat dissipation, and efficient power distribution.

Industrial Control Systems: Multilayer PCBs are utilized in industrial control systems for process control, factory automation, and robotics. These systems require reliable and high-performance PCBs to ensure precise control and monitoring of industrial processes.

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