TOP Multilayer FPC Circuit Board Guidelines Rigid Flex Pcb Design

TOP Multilayer FPC Circuit Board Rigid Flex Pcb Design Guidelines

Product introduction

Material FPC

Number of floors: 4

Copper thickness 1oz

Plate thickness 0.2mm

Minimum hole diameter 0.15mm

Minimum line distance 0.065mm

Minimum line width 0.065mm

Surface treatment gold deposit

FPC is widely used in the following fields:

1. Laptop computer, LCD display, optical drive, hard disk;

2. Printer, fax machine, scanner, sensor;

3. Mobile phone, mobile phone battery, interphone, mobile phone antenna, mobile phone dual card, mobile phone flat cable;

4. Various high-end cameras, digital cameras, digital video cameras, DV;

5. VCR head, laser head, CD-ROM, VCD, CD, DVD;

6. Aerospace, satellite/medical instruments, instruments, automotive instruments;

7. Light bar, LED FPC flash lamp, toy, collar, lighting.

FPC Prototyping

What does Flex PCB prototyping mean? Why Flexible PCB prototyping? What is the function of Flex Circuits prototyping? Flex PCB prototyping refers to the designer has designed the drawings, but to ensure no mistakes and perfect PCB performance, the test products, i.e. samples, will be made before mass production.

Flexible PCB prototyping first needs to give the specific PCB data for prototyping to the partner manufacturers. Take the PCB manufacturer as an example. First of all, we need to give the specific data of PCB prototyping to the staff, who will quote the customers and the delivery cycle of products according to the specific data, process requirements and proofing quantity. If both parties think there is no problem, after both parties sign the cooperation contract, the staff will arrange the order and follow up on the production progress.

Flex Circuit Board Cutting
Customized size cutting can save costs:
First, the first step is material cutting. It is necessary to cut the board according to the data and design requirements provided by the customer, and cut the substrate material to the required size. After cutting, the substrate needs to be pretreated to remove the surface pollutants of copper film and improve the surface roughness, which is conducive to the subsequent film pressing process.

Flexible PCB Structure Layer formation
Lamination-Exposure Development-PTH Removal:
PCB, the inner layer shall be pressed first, and the copper surface of the finished substrate shall be pasted with an anti-corrosion dry film through hot pressing. Then, after exposure and development, the image on the original negative film is transferred to the photosensitive base plate through the action of the light source, and the dry film without chemical reaction is washed off with alkali solution, leaving the dry film with chemical reaction as the anti-corrosion protective layer during corrosion. The exposed copper after development is corroded by the drug solution to form the required inner line pattern.

Advantage