COB Immersion Gold Aluminum PCB Board For Ultra High Thermal Conductivity Product

Metal core pcb production:

Metal Core PCBs (Printed Circuit Boards) are specialized circuit boards that have a base layer made of metal, typically aluminum, instead of the traditional FR4 (fiberglass-reinforced epoxy) material. These boards are commonly used in applications that require efficient heat dissipation, such as high-power LED lighting, power supplies, automotive electronics, and power electronics.

The production process for metal core PCBs is similar to that of traditional PCBs but with some additional considerations for the metal layer. Here are the general steps involved in the production of metal core PCBs:

1,Design: Create a PCB layout using PCB design software, taking into account the circuit requirements, component placement, and thermal considerations.,

2,Material Selection: Choose the appropriate metal core material for your application. Aluminum is the most common choice due to its good thermal conductivity, lightweight, and cost-effectiveness. Other options include copper and alloys like aluminum-backed copper-clad laminates.

3,Base Layer Preparation: Start with a metal sheet of the chosen material, typically aluminum. The sheet is cleaned and treated to remove any contaminants and oxidation, ensuring good adhesion between the metal and the PCB layers.,

4,Lamination: Apply a layer of thermally conductive dielectric material, such as an epoxy-based resin, on both sides of the metal core. This dielectric layer provides electrical insulation and helps to bond the copper layers.

5,Copper Cladding: Add a thin layer of copper to both sides of the dielectric material using methods like electroless copper plating or a combination of electroless and electrolytic copper plating. The copper layer serves as the conductive traces and pads for the circuit.,

6,Imaging: Apply a photosensitive resist layer over the copper surfaces. Expose the resist layer to UV light through a photomask that contains the desired circuit pattern. Develop the resist to remove the unexposed areas, leaving the circuit pattern on the copper.

7,Etching: Submerge the board in an etchant solution that removes the unwanted copper, leaving only the circuit traces and pads as defined by the resist layer. Rinse and clean the board thoroughly after etching.,

8,Drilling: Drill holes through the board at designated locations for component mounting and interconnection. These holes are typically plated through with copper to provide electrical continuity between the layers.

9,Plating and Surface Finish: Further copper plating may be performed to increase the thickness of the circuit traces and pads if required. Apply a surface finish, such as HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel Immersion Gold), or OSP (Organic Solderability Preservative), to protect the exposed copper and facilitate soldering.,

10,Solder Mask and Silkscreen: Apply a solder mask to cover the copper traces and pads, leaving only the desired soldering areas exposed. Apply a silkscreen layer to add component labels, reference designators, and other markings.

11,Testing and Inspection: Conduct electrical testing, such as continuity checks and netlist verification, to ensure the integrity of the circuit. Inspect the board for any manufacturing defects or errors.,

12,Assembly: Mount electronic components onto the metal core PCB using automated pick-and-place machines or manual soldering, depending on the complexity and volume of production.

13,Final Testing: Perform functional testing on the assembled PCB to verify its performance and ensure it meets the required specifications.

It's important to note that the production process can vary depending on the specific requirements of the metal core PCB, the chosen materials, and the manufacturer's capabilities. It's recommended to consult with a professional PCB manufacturer for specific guidelines and recommendations tailored to your project.