High Frequency Rogers Fr4 Epoxy Resin Mix Stack Up Multilayer PCB

High Frequency Rogers Fr4 Epoxy Resin Mix Stack Up Multilayer PCB

FR4 PCB Specification:

Material: Rogers4350B(0.254mm)+FR4,Rogers 4003C+FR4

PP material:KB6050,prepreg pcb

Layer:10

Classify:High frequency fr4 mix stack up pcb boards

Surface finish: Immersion gold,ENIG

Size:18*28CM

Min hole:0.25MM

Copper weight:0.5OZ

Special requirements: All Vias have to be filled and capped

Product name: rogers fr4 material properties, rogers fr4 datasheet, fr4 rogers 4350

Stack up file:

Rogers Fr4:

Rogers 4003C with FR4 hybrid stackup PCB

Rogers 4350B Mixed Pressure FR4 PCB

Rogers 5880 Stack up FR4

Main signal layer use rogers material, and the second layer use fr4

PCB Rogers and fr4 mix design more cheaper than Rogers+rogers

PP material choosing:

Rogers+rogers→ rogers prepreg(4450B/4450F)

Rogers+fr4→ rogers prepreg(4450B/4450F) or fr4(KB6050/6065/SP120N)

RO4450B and RO4450F Bondply

PCB manufacturer China,Rogers PCB,4003,4350 PCB,RF HIGH FREQUENCY PCB Manufacturing, Rapid Prototyping, Low cost production
high-frequency performance for wired and wireless communications circuits worldwide.
FR4 is very poor and only used where cost is more important than performance.Prototype PCB Dielectric Materials FR-4 vs. Rogers PCB Material Comparison
For some designs, dielectric PCB properties are critical
Whether it's high-speed designs, RF, microwave, or mobile applications-where power management is key, you're finding more situations that require dielectric PCB properties in your prototypes that standard FR-4 just can't deliver. We know that. That's why we've added Rogers 4350dielectric materials to our Quickturn product line. These new low-loss dielectric materials mean greater performance for your high-demand PCB prototype

Rogers High Frequency 4350B Material Laminate in stock

Rogers pcb material in stock:
Rogers4003C: thickness(0.254 0.508,0.813,1.524) DK 3.38
Rogers4350B: thickness(0.254 0.508,0.762,1.524) DK 3.5
Rogers5880: thickness(0.254 0.508,0.762) DK 2.2
Rogers3003: thickness(0.127,0.254,0.508,0.762,1.524) DK 3

Rogers3006:thickness(0.254) DK6.15
Rogers3010: thickness(0.635) DK 10.2
Rogers3206: thickness(0.635) DK 10.2
Rogers3035: thickness(0.508) DK 3.5
Rogers6010: thickness(0.635,1.27) DK 10.2

FR4 Material Types

FR-4 has many different variations depending on the thickness of the material and chemical properties, such as the standard FR-4 and G10. The following list shows some common designations for FR4 PCB materials.

Standard FR4: This is the most common type of FR4. It provides good mechanical and moisture resistance, with heat resistance of about 140℃ to 150℃.

FR4 With High Tg: FR4 with high Tg is suitable for applications requiring high thermal cycling and temperatures greater than 150℃. Standard FR4 is limited to around 150℃, while FR4 with high Tg can withstand much higher temperatures.

FR4 With High CTI: FR4 with high CTI (Chemical Thermal Interaction) has better thermal conductivity than regular FR4 material. It has a comparative tracking index higher than 600 Volts.

FR4 without copper laminate: FR4 without copper laminate is a non-conductive material with excellent mechanical strength. It is mainly suitable for insulating boards and board supports.

FR4 G10: FR-4 G10 is a solid core material with excellent mechanical properties, high thermal shock resistance, excellent dielectric properties, and good electrical insulation properties.

The requirements of high frequency pcb material:

(1) the dielectric constant (Dk) must be very stable

(2) Dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller the dielectric loss so that the signal loss is also smaller.

(3) and copper foil thermal expansion coefficient as far as possible, because inconsistencies in the change in the cold and heat caused by copper foil separation.

(4) low water absorption, high water absorption will be affected in the damp when the dielectric constant and dielectric loss.

(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.

What Is FR4 PCB Material?

FR-4 is a high-strength, high-resistant, glass-reinforced epoxy laminate material used to fabricate printed circuit boards (PCBs). The National Electrical Manufacturers Association (NEMA) defines it as a standard for glass-reinforced epoxy laminates.

The FR stands for flame retardant, and the number 4 differentiates this type of laminate from other similar materials. This particular laminate has woven glass-reinforced epoxy resin.

FR-4 PCB refers to the board manufactured with adjacent laminate material. This material is incorporated in double-sided, single-sided, and multi-layered boards.

ONESEINE'S STANDARD FR-4 MATERIAL PROPERTIES

High Glass Transition Temperature (Tg) (150Tg or 170Tg)

High Decomposition Temperature (Td) (> 345º C)

Low Coefficient of Thermal Expansion (CTE) ((2.5%-3.8%)

Dielectric Constant (@1 GHz): 4.25-4.55

Dissipation Factor (@ 1 GHz): 0.016

UL rated (94V-0, CTI = 3 minimum)

Compatible with standard and lead-free assembly.

Laminate thickness available from 0.005” to 0.125”

Pre-preg thicknesses available (approximate after lamination):

(1080 glass style) 0.0022”

(2116 glass style) 0.0042”

(7628 glass style) 0.0075”

FR4 PCB Applications:

FR-4 is a common material for printed circuit boards (PCBs). A thin layer of copper foil is typically laminated to one or both sides of an FR-4 glass epoxy panel. These are commonly referred to as copper clad laminates. The copper thickness or copper weight can vary and so is specified separately.

FR-4 is also used in the construction of relays, switches, standoffs, busbars, washers, arc shields, transformers and screw terminal strips.