FR 4 TG150 2 Layer fr4 2116 7628 PCB Printed Circuit Boards

FR 4 TG150 2 Layer Fr4 2116 7628 PCB Printed Circuit Boards

Basic information:

Size:9*12CM

Layer:2

Surface finish: HASL Lead free

Thickness:1.2mm

Copper weight:1.5OZ outer

Color:Yellow solder mask

FR4 copper clad is short for fiberglass epoxy resin copper clad, it’s divided into the following levels:

FR-4 A1 level CCL: This level of CCL is mainly used in military, communications, computers, digital circuits, industrial instrumentation, automotive circuits and other electronic products.

This level of CCL widely used, the technical performance indicators to meet the needs of all the electronic products.

This level of product quality and fully meet world-class level, the highest level, the best performance of the product.

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FR-4 A2 level CCL: This level of CCL is mainly used ordinary computer, instrumentation, advanced home appliances and electronic products in general. This grade series CCL widely used, the performance index can meet the general needs of industrial electronic products. A very good price-performance ratio, enabling customers to effectively improve their competitiveness.

FR-4 A3 level CCL: This level CCL is mainly used household appliances, computer peripheral products and general electronic products (such as toys, calculators, games, etc.) development and production of FR-4 product. It is characterized by its performance to meet the requirements of the premise, highly competitive prices.

Products made of epoxy glass fiber board FR - 4, FR - 1, CEM 1, CEM, thick copper foil printed circuit board, high TG PCB, heat dissipation aluminum circuit boards, ultra-small ultra-thin PCB, COB dependend PCB, ceramic plate, high-frequency boards, etc.Surface treatment: hot air leveling (HAL), the full plate electroplating nickel, gold, gold finger, unleaded tin (HASL), chemical gold/silver/tin, prevent oxidation treatment (OSP) and so on.

FR4 is a glass fiber epoxy laminate, is the Main material for PCB manufacture.FR4 glass fiber epoxy laminate surface colors: yellow FR-4, white FR-4, black FR-4,blue FR-4 and so on.We are the China's largest exporter of pcb board, we have various types of fr4 materials can be meet the different requirement of customers, and the PCB with ROHS standards, quality assurance of Fr4 materials etc., meantime to provide the most affordable price, also offer one-stop service, to protect the interests of customers.

Product Description

What Is FR4 PCB Material?

FR-4 is a high-strength, high-resistant, glass-reinforced epoxy laminate material used to fabricate printed circuit boards (PCBs). The National Electrical Manufacturers Association (NEMA) defines it as a standard for glass-reinforced epoxy laminates.

The FR stands for flame retardant, and the number 4 differentiates this type of laminate from other similar materials. This particular laminate has woven glass-reinforced epoxy resin.

FR-4 PCB refers to the board manufactured with adjacent laminate material. This material is incorporated in double-sided, single-sided, and multi-layered boards.

ONESEINE'S STANDARD FR-4 MATERIAL PROPERTIES

High Glass Transition Temperature (Tg) (150Tg or 170Tg)

High Decomposition Temperature (Td) (> 345º C)

Low Coefficient of Thermal Expansion (CTE) ((2.5%-3.8%)

Dielectric Constant (@1 GHz): 4.25-4.55

Dissipation Factor (@ 1 GHz): 0.016

UL rated (94V-0, CTI = 3 minimum)

Compatible with standard and lead-free assembly.

Laminate thickness available from 0.005” to 0.125”

Pre-preg thicknesses available (approximate after lamination):

(1080 glass style) 0.0022”

(2116 glass style) 0.0042”

(7628 glass style) 0.0075”

Here are some key aspects related to the thermal stability of FR4 PCBs:

The thermal stability of FR4 PCBs refers to their ability to withstand and operate under different temperature conditions without experiencing significant degradation or performance issues.

FR4 PCBs are designed to have good thermal stability, meaning they can handle a wide temperature range without warping, delaminating, or suffering from electrical or mechanical failures.

Glass Transition Temperature (Tg): Tg is an important parameter that characterizes the thermal stability of FR4. It represents the temperature at which the epoxy resin in the FR4 substrate undergoes a transition from a rigid state to a more flexible or rubbery state. FR4 PCBs typically have a Tg value around 130-180°C, which means they can withstand elevated temperatures without significant changes in their mechanical properties.

Coefficient of Thermal Expansion (CTE): CTE is a measure of how much a material expands or contracts with changes in temperature. FR4 PCBs have a relatively low CTE, which ensures that they can withstand thermal cycling without excessive stress or strain on the components and solder joints. The typical CTE range for FR4 is around 12-18 ppm/°C.

Thermal Conductivity: FR4 itself is not highly thermally conductive, which means it is not an excellent heat conductor. However, it still provides adequate heat dissipation for most electronic applications. To enhance the thermal performance of FR4 PCBs, additional measures can be taken, such as incorporating thermal vias or using additional heat sinks or thermal pads in critical areas to improve heat transfer.

Soldering and Reflow Processes: FR4 PCBs are compatible with standard soldering and reflow processes commonly used in electronic assembly. They can withstand the elevated temperatures involved in soldering without significant damage or dimensional changes.

It's important to note that while FR4 PCBs have good thermal stability, they still have limits. Extreme temperature conditions, such as very high temperatures or rapid temperature changes, can potentially cause stress, delamination, or other issues. Therefore, it's important to consider the specific operating environment and choose appropriate materials and design considerations accordingly.

FR4 PCBs are known for their excellent thermal stability, high mechanical strength, and resistance to moisture and chemicals. These properties make them suitable for a wide range of applications, including consumer electronics, telecommunications, automotive, industrial equipment, and more.

The FR4 material consists of a thin layer of copper foil laminated onto a substrate made of woven fiberglass cloth impregnated with epoxy resin. The copper layer is etched to create the desired circuit pattern, and the remaining copper traces provide the electrical connections between components.

The FR4 substrate offers good dimensional stability, which is important for maintaining the integrity of the circuitry over a wide range of temperatures. It also has low electrical conductivity, which helps prevent short circuits between adjacent traces.

In addition to its electrical properties, FR4 has good flame retardant properties due to the presence of halogenated compounds in the epoxy resin. This makes FR4 PCBs suitable for applications where fire safety is a concern.

Overall, FR4 PCBs are widely used in the electronics industry due to their excellent combination of electrical performance, mechanical strength, thermal stability, and flame retardancy.