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[China]
Trade Verify
Address: Address:Room624,Fangdichan development building,Guicheng south,Nanhai,Foshan,China
Contact name:Tracy
ONESEINE TECHNOLOGY CO.,LTD |
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Verified Suppliers
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Electronics Prototype PCB Assembly Service Manufacturer in China
Quick detail:
Layer:4
Board material:Fr4
Surface finish:HASL lead free
Copper weight:1OZ
Board thickness:1.6mm
PCB assembly:yes
Solder mask:Green
Silkscreen:White
Product name:4 Layer PCB assembly prototype
Prototype PCB Assembly
PCB prototyping has always been one of our most requested services, whether it’s PCB prototype fabrication or assembly. Our expert engineers will check and test your layout to ensure the correct prototype is fabricated and assembled on the first
assembly run. Through our network of PCB component suppliers and SMT assembly engineers, we can ensure you a quick turn around and top quality circuit board. We offer low volume circuit assembly for prototyping with DFM and DFT to eliminate possible issues in your product.
Board and System Board Level Testing:
AOI Testing | X-Ray Inspection | In Circuit Testing |
solder paste | Micro BGAs | Power-up Test |
components down to 0201" | Chip scale packages | Advanced Function Test |
components, offset, incorrect parts | Bare boards | Flash Device Programming |
Electronics Prototype PCB Assembly Service
EMS-Electronic Manufacturing Service
PCB Supply and Layout
PCB Assembly on SMT, BGA and DIP
Cost Effective Components Sourcing
Fast Turn Prototype and Mass Production
Box Build Assembly
Engineering Support
Tests(X-ray, 3D Paste Thickness, ICT, AOI and Functional tests)
Logistics and After-sales Service
Product Pestcription
PCBA Layers | 1 Layers to 12 layer (standard) |
Material | FR4, Aluminum, CEM1 |
Solder mask | green, black, white, red, blue |
Copper thickness | 0.5um-4um |
Surface finish | HASL,ENIG,OSP |
Min holes | 0.2mm by machine; 0.1mm by Laser Drilling |
Min track width | 3mil |
PCB Dimension | 600x1200mm |
IC Pitch(min) | 0.2mm |
Chip Size(min) | 0201 |
BGA Size | 8x6mm~55x55mm |
SMT Efficiency | SOP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA |
U-BGA ball dia. | 0.2mm |
Required Docs for PCBA | Gerber file with BOM list & Pick-N-Place File(XYRS) |
SMT speed | CHIP components SMT speed 0.3S/pcs, max speed 0.16S/pcs |
The PCB assembly process typically includes the following steps:
Component Procurement: The required electronic components are sourced from suppliers. This involves selecting components based on specifications, availability, and cost.
PCB Fabrication: The bare PCBs are manufactured using specialized techniques such as etching or printing. The PCBs are designed with copper traces and pads to establish electrical connections between the components.
Component Placement: Automated machines, called pick-and-place machines, are used to accurately place surface mount components (SMD components) on the PCB. These machines can handle a large number of components with precision and speed.
Soldering: Once the components are placed on the PCB, soldering is performed to establish electrical and mechanical connections. There are two common methods used for soldering: a. Reflow Soldering: This method involves applying solder paste to the PCB, which contains small solder balls. The PCB is then heated in a reflow oven, causing the solder to melt and create connections between the components and the PCB. b. Wave Soldering: This method is typically used for through-hole components. The PCB is passed over a wave of molten solder, which creates solder connections on the bottom side of the board.
Inspection and Testing: After soldering, the assembled PCBs undergo inspection to check for defects, such as solder bridges or missing components. Automated optical inspection (AOI) machines or human inspectors perform this step. Functional testing may also be conducted to ensure the PCB operates as intended.
Final Assembly: Once the PCBs pass inspection and testing, they can be integrated into the final product. This may involve additional assembly steps, such as attaching connectors, cables, enclosures, or other mechanical components.
Certainly! Here are some additional details about PCB assembly:
Surface Mount Technology (SMT): Surface mount components, also known as SMD (Surface Mount Device) components, are widely used in modern PCB assembly. These components have small footprints and are mounted directly onto the surface of the PCB. This allows for higher component density and smaller PCB sizes. SMT components are typically placed using automated pick-and-place machines, which can handle components of various sizes and shapes.
Through-Hole Technology (THT): Through-hole components have leads that pass through holes in the PCB and are soldered on the opposite side. While SMT components dominate modern PCB assembly, through-hole components are still used for certain applications, especially when components require extra mechanical strength or high power handling capabilities. Wave soldering is commonly used for soldering through-hole components.
Mixed Technology Assembly: Many PCBs incorporate a combination of surface mount and through-hole components, referred to as mixed technology assembly. This allows for a balance between component density and mechanical strength, as well as accommodating components that are not available in surface mount packages.
Prototype vs. Mass Production: PCB assembly can be performed for both prototype and mass production runs. In prototype assembly, the focus is on building a small number of boards for testing and validation purposes. This may involve manual component placement and soldering techniques. Mass production, on the other hand, requires high-speed automated assembly processes to achieve efficient and cost-effective production of large quantities of PCBs.
Design for Manufacturing (DFM): DFM principles are applied during the PCB design phase to optimize the assembly process. Design considerations such as component placement, orientation, and proper clearances help ensure efficient assembly, reduce manufacturing defects, and minimize production costs.
Quality Control: Quality control is an integral part of PCB assembly. Various inspection techniques are employed, including visual inspection, automated optical inspection (AOI), and X-ray inspection, to detect defects such as solder bridges, missing components, or incorrect orientations. Functional testing may also be conducted to verify the proper operation of the assembled PCB.
RoHS Compliance: Restriction of Hazardous Substances (RoHS) directives restrict the use of certain hazardous materials, such as lead, in electronic products. PCB assembly processes have adapted to comply with RoHS regulations, using lead-free soldering techniques and components.
Outsourcing: PCB assembly can be outsourced to specialized contract manufacturers (CMs) or electronic manufacturing service (EMS) providers. Outsourcing allows companies to leverage the expertise and infrastructure of dedicated assembly facilities, which can help reduce costs, increase production capacity, and access specialized equipment or expertise.
