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Connectors QSFP DD Pcb Design And Manufacturing

Topmatch Electronics (Suzhou) Co., Limited.
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Address: Room 301, Building 1, Shahu Science and Technology Park, SIP, SUZHOU City,Jiangsu Province,P.R.C

Contact name:Jerry He

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Topmatch Electronics (Suzhou) Co., Limited.

Connectors QSFP DD Pcb Design And Manufacturing

Country/Region china
City & Province suzhou jiangsu
Categories Connectors
InquireNow

Product Details

QSFP-DD PCB board,8Layer Plus 2 HDI, gold finger,100G material

 

Identical mating interface as the QSFP+ connector for backward compatibility
Protects end user's current QSFP+ infrastructure investment

 

Nickel-plated heat sink
Provides increased thermal transfer from module to heat sink

 

0.80mm-pitch host connector designed for placement beneath EMI cage
Supports pluggable applications

 

QSFP-DD Cable Assemblies

 

Our PCB manufacturing capabilities enable us to produce a wide range of products, We can make just about any printed circuit board you can think of including HDI PCB, Multilayer PCBs (up to 40layers),High-tech PCB, Thick Copper PCB, Halogen PCB as standard options, and more special PCBs such as Flex-Rigid PCB, aluminum PCB and Rogers PCB.

 

  • Multi-layer PCBs Capability (1 to 40L)
  • Controlled Impedance Circuit Boards
  • 100% Electrical Testing
  • 3 mil Traces/3 mil Spaces
  • FR4,Roger,Teflon and others
  • Maximum Panel Size: 19.7" x 31.5"
  • High Density Interconnect PCBs
  • Blind, Buried and Plugged Vias
  • Smallest Hole size: 0.1mm/0.004"/4mil
  • Lead-Free compliant PCBs

 

Product application

 

Optical module

 

QSFP-DD(Quad Small Form-factor Pluggable-Double Density) has a four-channel SFP-DD interface, a single-channel transmission rate of 56Gbps, and a transmission rate of 100Gbps. It is applicable to high-performance switch, router, server and host bus adapter in calculation and telecom application, with enterprise storage, high density, high-speed I/O, and multi-channel interconnection.

 

Specifications:

 

NameQSFP-DD PCB board
Layers8
Quality GradeIPC 6012 Class 2,IPC 6012 Class 3
MaterialTachyon 100G
Thickness1.0mm
Min Track/Spacing75um/75um
Drilling Size0.15mm
Solder MaskGreen
SilkscreenWhite
Surface FinishImmersion gold + ENEPIG
Finished Copper12um
Production time10-21 working days
Lead time2-3 days
 

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