Home Companies Shenzhen Hengxunda Circuit Technology Co.,LTD

doule sided pcb printed cirucit board 2layers pcb riged double side fr4 printed circuit boards cald pcb double sided

Shenzhen Hengxunda Circuit Technology Co.,LTD
Active Member

Contact Us

[China] country

Address: Rm1104, No.17 Lane 6 Huangjinshan Community, Bantian Street, Longgang District, Shenzhen

Contact name:angelina

Inquir Now

Shenzhen Hengxunda Circuit Technology Co.,LTD

doule sided pcb printed cirucit board 2layers pcb riged double side fr4 printed circuit boards cald pcb double sided

Country/Region china
City & Province shenzhen
Categories Other Measuring & Analysing Instruments
InquireNow

Product Details

 

Process Capability And Checking Parameters(Hard Board)
NOITEMTechnical Capabilities
1Layers1-38L
2Max.Board Size1200*610mm
48"*24"
3Finished Board Thickness0.2mm--10.0mm
0.008"--0.4"
4Finished Copper Thickness17um-420um
0.5OZ--12OZ
5Min.Trace Width/Space0.075mm/0.065mm
0.003"/0.0026"
6Min.Hole Size0.15mm
0.006"
7Hole Dim. Tolerance(PTH)±0.05mm
±0.002"
8Hole Dim.Tolerance(NPTH)±0.05mm
±0.002"
9Drill Location Tolerance±0.05mm
±0.002"
10V-Cut Degrees20-90 ºC
20DEG-90DEG
11Min.V-Cut PCB Thickness0.4mm
0.016"
12N/C Routing Tolerance±0.1mm
±0.004"
13Min.Blind/Buried Via0.15mm
0.06"
14Plug Hole Size0.2mm--0.6mm
0.008"--0.024"
15Min.BGA PAD0.2mm
0.008"
16MaterialsFR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB
17Surface FinishHASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F
18Warp & Twist≤0.75%
19Electrical Testing50--300V
20Solderability Testing245±5ºC,3sec Wetting area least95%
21Thermal Cycling Testing288±5ºC,10sec,3cycles
22Ionic Contamination TestingPb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm
23Soldmask Adhesion Testing260ºC+/-5, 10S,3times

Hot Products

Process Capability And Checking Parameters(Rigid PCB) NO ITEM Technical Capabilities 1 Layers 1-38L ...
Process Capability And Checking Parameters(Hard Board) NO ITEM Technical Capabilities 1 Layers 1-38L ...
Process Capability And Checking Parameters(Hard Board) NO ITEM Technical Capabilities 1 Layers 1-38L ...
Process Capability And Checking Parameters(Hard Board) NO ITEM Technical Capabilities 1 Layers 1-38L ...
Process Capability And Checking Parameters(Hard Board) NO ITEM Technical Capabilities 1 Layers 1-38L ...
Process Capability And Checking Parameters(Hard Board) NO ITEM Technical Capabilities 1 Layers 1-38L ...