Process Capability And Checking Parameters(Hard Board) |
NO | ITEM | Technical Capabilities |
1 | Layers | 1-38L |
2 | Max.Board Size | 1200*610mm |
48"*24" |
3 | Finished Board Thickness | 0.2mm--10.0mm |
0.008"--0.4" |
4 | Finished Copper Thickness | 17um-420um |
0.5OZ--12OZ |
5 | Min.Trace Width/Space | 0.075mm/0.065mm |
0.003"/0.0026" |
6 | Min.Hole Size | 0.15mm |
0.006" |
7 | Hole Dim. Tolerance(PTH) | ±0.05mm |
±0.002" |
8 | Hole Dim.Tolerance(NPTH) | ±0.05mm |
±0.002" |
9 | Drill Location Tolerance | ±0.05mm |
±0.002" |
10 | V-Cut Degrees | 20-90 ºC |
20DEG-90DEG |
11 | Min.V-Cut PCB Thickness | 0.4mm |
0.016" |
12 | N/C Routing Tolerance | ±0.1mm |
±0.004" |
13 | Min.Blind/Buried Via | 0.15mm |
0.06" |
14 | Plug Hole Size | 0.2mm--0.6mm |
0.008"--0.024" |
15 | Min.BGA PAD | 0.2mm |
0.008" |
16 | Materials | FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB |
|
17 | Surface Finish | HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F |
|
18 | Warp & Twist | ≤0.75% |
|
19 | Electrical Testing | 50--300V |
|
20 | Solderability Testing | 245±5ºC,3sec Wetting area least95% |
|
21 | Thermal Cycling Testing | 288±5ºC,10sec,3cycles |
|
22 | Ionic Contamination Testing | Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm |
|
23 | Soldmask Adhesion Testing | 260ºC+/-5, 10S,3times |
|