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OEM ODM PCBA Wireless Marking Gun Power And Driver Electronic Control Board JY PCB FR4 CEM1 CEM3 Hight TG 1-20 Layers

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OEM ODM PCBA Wireless Marking Gun Power And Driver Electronic Control Board JY PCB FR4 CEM1 CEM3 Hight TG 1-20 Layers

Country/Region china
City & Province shenzhen guangdong
Categories Active Components
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Product Details

 

OEM ODM PCBA Wireless Marking Gun Power and Driver Electronic Control Board JY PCB FR4 CEM1 CEM3 Hight TG +/-0.003" 1~20 Layers

 

 

DescriptionCapability
Min Plated Drills to Copper

0.25mm, 0.30mm

Material

FR4 CEM1 CEM3 Hight TG

Copper Thickness

1~4oz

Min. Hole Size

0.15mm

 

The OEM (Original Equipment Manufacturer) and ODM (Original Design Manufacturer) PCBA (Printed Circuit Board Assembly) for a wireless marking gun power and driver electronic control board involves the production of a customized PCB with specific requirements. Here's a description of the key aspects related to this project:

OEM/ODM Manufacturing: OEM refers to a company that designs and manufactures a product based on the specifications provided by another company, while ODM refers to a company that designs and manufactures a product based on their own specifications and branding. In the case of the wireless marking gun power and driver electronic control board, the OEM/ODM PCBA manufacturer will work closely with you to understand your requirements and develop a customized solution.

 

PCB Materials: The PCBA manufacturer will offer various PCB material options such as FR4, CEM1, CEM3, and high TG (Glass Transition Temperature). FR4 is a widely used and cost-effective material with good electrical properties. CEM1 and CEM3 are composite materials that offer improved thermal performance. High TG materials have a higher glass transition temperature, making them suitable for applications that require elevated temperatures.

Layer Count: The layer count refers to the number of conductive layers within the PCB. For the wireless marking gun power and driver electronic control board, the layer count can range from 1 to 20 layers, depending on the complexity of the design and the functionality required. The PCBA manufacturer will ensure that the layer stack-up is optimized for signal integrity, power delivery, and manufacture ability.

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