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The SiC Substrate also has a surface roughness of Ra<0.5nm, which is essential for applications that require high precision. This substrate is suitable for use in different industries, including electronics, aerospace, and automotive. The substrate has a tensile strength of >400MPa, making it highly durable and able to withstand high levels of stress.
The SiC Substrate has a density of 3.21 G/cm3, which is ideal for applications that require a lightweight material. The substrate is available in custom shapes and sizes, including 10x10mm and 5x5mm. The substrate is also available in customzied shape sic plates, making it suitable for various applications.
In summary, the SiC Substrate is a high-quality product that offers excellent thermal conductivity, surface hardness, and tensile strength. Its lightweight and customizability make it ideal for various applications in different industries.
The SiC substrate material has a thermal expansion coefficient of 4.5 X 10-6/K and is a high-performance substrate type. The surface flatness is λ/10@632.8nm, and the surface hardness is HV0.3>2500. The material used is SiC Monocrystal, which is a high-quality material that is known for its durability and strength.
These silicon carbide wafers are ideal for a variety of applications, including electronic devices, LED lighting, and power electronics. The substrate can also be used for sic laser cutting, where it is used as a cutting tool for precision cutting of materials. The substrate can be customized to fit specific shapes and sizes, making it a versatile product for a range of industries.
If you need customzied shape sic plates, ZMSH SIC010 is the perfect solution. With its high-quality material and precise cutting capabilities, the substrate can be tailored to meet your needs. Whether you need a small or large quantity, ZMSH SIC010 can provide you with the product you need at a competitive price.
ZMSH SIC Substrate Product Customization Services:
We offer customized size SiC wafer and SiC laser cutting services. Our silicon carbide wafers are of high quality and meet industry standards.
Product Packaging:
The SiC substrate product will be packaged securely in a hard plastic container to prevent any damage during shipping. The container will be labeled with the product name, quantity, and any necessary handling instructions.
Shipping:
The SiC substrate product will be shipped via a trusted carrier, such as UPS or FedEx, to ensure safe and timely delivery. The shipping costs will be calculated based on the destination and weight of the package. Customers can track their orders using the provided tracking number.