HF Rogers 4350 Mix Stack up Multilayer PCB Board / FR4 8 Layers PCB

HF Rogers 4350 Mix Stack up Multilayer PCB Board / FR4 8 Layers PCB

Quick detail:

Material: Rogers 4350B 0.254MM 0.508MM

PP material Rogers 4450

Core: 3 or 4

Stack up files: Necessary

Gerber files:Necessary

Specification

High-frequency circuit board processing special features:

1, The impedance control requirements more stringent, the relative linewidth control is very strict, around two percent general tolerance.

2, Due to the special substrate, the adhesion of electroless copper PTH when not high, usually by means of plasma processing equipment for the first through-hole and surface roughened to increase the PTH copper and solder resist ink adhesion.

3, Before the solder can not do the grinding plate, or adhesion will be poor, only with medicine and other micro-erosion roughened.

4, Most of material are polytetrafluoroethylene,will have many burrs if use common cuts, need use specialized cuts.

5, High-frequency circuit board is a special high frequency electromagnetic circuit board, generally defined as the frequency of the high frequency of 1GHz. Its physical properties, precision, technical parameters required is very high, commonly used in automotive anti-collision systems, satellite systems, radio systems.

Our products are widely used in high-tech communications, power, instrumentation, computer networks, digital products, industrial control, scientific, educational, medical, aerospace and defense. Main material: rogers laminate

Description:

HF Rogers 4350 8 Layers PCB boards
A dielectric material is a substance that is a poor conductor of electricity, and used as an insulating layer in the PCB build up. Porcelain, mica, glass, plastics and some metal oxides are good dielectrics. The lower the dielectric loss, (the proportion of energy lost as heat) the more effective the dielectric material. If the voltage across a dielectric material becomes too great -- that is, if the electrostatic field becomes too intense -- the material will suddenly begin to conduct current. This phenomenon is called dielectric breakdown.
Our high density circuit boards have the technology pushing capabilities to drive applications in a large number of industries including but not limited to semiconductor test equipment, defense, medical and aerospace.

RO4000 material’s thermal coeffi cient of expansion (CTE) provides several key benefi ts to the circuit designer. The expansion coeffi cient of RO4000 material is similar to that of copper which allows the material to exhibit excellent dimensional stability, a property needed for mixed dielectric multilayer boards constructions. The low Z-axis CTE of RO4000 laminates provides reliable plated through-hole quality, even in severe thermal shock applications. RO4000 series material has a Tg of >280°C (536°F) so its expansion characteristics remain stable over the entire range of circuit processing temperatures. RO4000 series laminates can easily be fabricated into printed circuit boards using standard FR4 circuit board processing techniques. Unlike PTFE based high performance materials, RO4000 series laminates do not require specialized via preparation processes such as sodium etch. This material is a rigid, thermoset laminate that is capable of being processed by automated handling systems and scrubbing equipment used for copper surface preparation.