Customized Electronic PCB Assembly High TG175 3 OZ Copper Thickess RoHS ENIG PCB

Customized Electronic PCB Assembly High TG175 3 OZ Copper Thickess RoHS ENIG PCB

Number of layers: 2 layers
Material: FR4
Board thickness: 1.6mm
Surface plating: ENIG
Special process description: 3OZ

Solder mask: Green

Please call GSC if you need:

Fast turn-around prototypes.
Low-Medium-High volume production requirements.
To meet your prodution schedules.
On time delivery with a quality product.
A competitive price

PROTOTYPE AND VOLUME PRODUCTION:
Single sided
Double sided
Multilayer up to 8 layers
Immersion white tin process

For PCBA order, provide us:

1. PCB Gerber file
2. BOM list for PCBA
3. Sample of PCB and PCBA
4. Test method for PCBA

Services and applications:

1. Through hole board assembly
2. SMT assembly including BGA assembly, smallest placement: 0201
3. Material procurement
4. Consigned material management
5. Plastic or metal enclosure
6. Complex final assembly
7. Functional test
8. Cable assembly
9. Labeling and packing
10. Customized logistics per customer
11. Laser cut framed SMT solder paste stencils
12. PCB design and schematic capture

PCBA capabilities:

1. Component height: 0.2-25mm
2. Min packing: 0201
3. Min distance from
4. BGA: 0.25-2.0mm
5. Min BGA size: 0.1-0.63mm
6. Min QFP space: 0.35mm
7. Min assembly size: 50*30mm
8. Max assembly size: 350*550mm
9. Pick-placement precision: 0.01mm
10. Pick-placement range: QFP, SOP, PLCC, BGA
11. Placement capability: 0805, 0603, 0402, 0201
12. High-pin count press fit available
13. SMT capacity per day: 3,200,000 point

Competitive advantages:

1. No minimum order quantity and free sample
2. Focus on low to medium volume production
3. Quick and on-time delivery
4. International approvals
5. Great customer service
6. Diversified shipping method