Active Member
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[China]
Address: Headquarters :F12, Xingji Building Shangxing Road Shajing Town ,Baoan District Shenzhen China
Contact name:Rose Guo
Global Success Circuits Co.,Ltd |
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Four Layer TG135 ENIG Rigid Printed Circuit Boards Fr4 Laminate Rohs Compliant
Three reasons to buy your Printed Circuit Boards from Global Success
If you care about cost of your printed circuit boards, but you cannot afford to compromise quality, you have landed in the right place and you need look no further!
At Global Success our focus is quality, and that extends beyond your PCB's. We promise you top notch customer service, communication, product management, and value.
Global Success certified facilities control every key process to eliminate all
potential issues before manufacturing begins.
Global Success utilizes advanced software to perform extensive DFM analysis on
incoming data, and uses advanced quality control systems throughout
the manufacturing process.
Global Success performs 100% visual and AOI inspection as well as performing electrical testing, High Voltage testing, impedance control testing, micro-sectioning, thermal shock testing, solder testing, reliability testing, insulating resistance testing and ionic cleanliness testing.
NO. | Item | Technical Specification | ||
Standard | Advanced | |||
| 1 | Number of Layer | 18 Layers | 32 Layers | |
| 2 | Lamination type | FR4(Tg130-180), Halogen free lamination,Rogers,Teflon,Aluminum board,PI | ||
| 3 | Finish Board Thickness | 0.3 mm ~ 6 mm | ||
| 4 | Copper Thickness | 5oz | 12oz | |
| 5 | Aspect rate | 08:01 | 12:01 | |
| 6 | Impedance | Single line | ±10% | ±8% |
| Differential line | ±10% | ±8% | ||
| 7 | Hole to line(min) on Pressing | 4L | 5mil | 4mil |
| 18L | 10mil | 8mil | ||
| 32L | 12mil | 10mil | ||
| 8 | Line width/space | Inner layer | 3/3mil | 2.5/2.5mil |
| Outer layer | 3/3mil | 3/3mil | ||
| 9 | Hole size | Min drill bit | 8mil | 6mil |
| Min Laser hole | 4mil | 4mil | ||
| 10 | Hole position tolerance | ±3mil | ±3mil | |
| 11 | PTH hole diameter tolerance | ±3mil | ±2mil | |
| 12 | NPTH hole diameter tolerance | ±2mil | ±1mil | |
| 13 | Solder mask | Line to solder PAD | 4mil | 3mil |
| Registration tolerance | ±2mil | ±1.5mil | ||
| 14 | Profile tolerance | Punching | ±5mil | |
| Routing | ±4mil | ±2mil | ||
| 15 | E-Test | SMT pitch(min) | 9mil | 9mil |
| BGA pitch(min) | 18mil | 18mil | ||
| 16 | Peelable mask thickness? | 5mil | 5mil | |
| 17 | Carbon ink thickness | 0.3mil | 0.3mil | |
| 18 | Lead and lead free HASL thickness | SMD:40-2000u” | ||
| GND:30-800u” | ||||
| 19 | Immersion Au | Au thickness | 1-5u” | 1-5u” |
| Ni thickness | 80-200u” | 80-200u” | ||
| 20 | Immersion tin thickness | 0.8-1.2um | 0.8-1.2um | |
| 21 | OSP thickness | 0.2-0.5um | 0.1-0.6um | |
| 22 | Immersion silver thickness | 0.15-0.45um | 0.15-0.45um | |
