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LMV611MF/NOPB Audio Power Amplifier IC Op Amps Lo Vltg,Low Pwr,RRIO Gen Purp amp

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ChongMing Group (HK) Int'l Co., Ltd

LMV611MF/NOPB Audio Power Amplifier IC Op Amps Lo Vltg,Low Pwr,RRIO Gen Purp amp

Country/Region china
City & Province shenzhen
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Product Details

LMV611MF/NOPB Audio Power Amplifier IC Op Amps Lo Vltg,Low Pwr,RRIO Gen Purp amp

 

1 Features

  • Supply Values: 1.8 V (Typical)
  • Ensured 1.8-V, 2.7-V, and 5-V Specifications

  • Output Swing:

    • – 80 mV From Rail With 600-Ω Load

    • – 30 mV From Rail With 2-kΩ Load

  • VCM = 200 mV Beyond Rails

  • 100-μA Supply Current (Per Channel)

  • 1.4-MHz Gain Bandwidth Product

  • Maximum VOS = 4 mV

  • Temperature Range: −40°C to +125°C

  • Create a Custom Design Using the LMV61x With the WEBENCH® Power Designer

     

2 Applications

  • Consumer Communication

  • Consumer Computing

  • PDAs

  • Audio Pre-Amplifiers

  • Portable or Battery-Powered Electronic Equipment

  • Supply Current Monitoring

  • Battery Monitoring

 

3 Description

The LMV61x devices are single, dual, and quad low- voltage, low-power operational amplifiers (op amps). They are designed specifically for low-voltage, general-purpose applications. Other important product characteristics are, rail-to-rail input or output, low supply voltage of 1.8 V and wide temperature range. The LMV61x input common mode extends 200 mV beyond the supplies and the output can swing rail-to-rail unloaded and within 30 mV with 2-kΩ load at 1.8-V supply. The LMV61x achieves a gain bandwidth of 1.4 MHz while drawing 100-μA (typical) quiescent current.

The industrial-plus temperature range of −40°C to 125°C allows the LMV61x to accommodate a broad range of extended environment applications.

The LMV611 is offered in the tiny 5-pin SC70 package, the LMV612 in space-saving 8-pin VSSOP and SOIC packages, and the LMV614 in 14-pin TSSOP and SOIC packages. These small package amplifiers offer an ideal solution for applications requiring minimum PCB footprint. Applications with area constrained PCB requirements include portable and battery-operated electronics.

Device Information

PART NUMBER

PACKAGE

BODY SIZE (NOM)

LMV611

SOT-23 (5)

2.92 mm × 1.60 mm

SC70 (5)

2.00 mm × 1.25 mm

LMV612

VSSOP (8)

3.00 mm × 3.00 mm

SOIC (8)

4.90 mm × 3.91 mm

LMV614

TSSOP (14)

5.00 mm × 4.40 mm

SOIC (14)

8.64 mm × 3.90 mm

 

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