ChongMing Group (HK) Int'l Co., Ltd |
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TMP75AIDGKR HVAC Temperature Sensors Board Mount Temperature Sensors Digital w/2-Wire Ifc
1 Features
TMP75: 8 Addresses, NIST Traceable
Digital Output: SMBusTM, Two-Wire, and I2C Interface Compatibility
Resolution: 9 to 12 Bits, User-Selectable
Accuracy:
– ±1°C (Typical) from −40°C to +125°C
– ±2°C (Maximum) from −40°C to +125°C
Low Quiescent Current: 50-μA, 0.1-μA Standby
Wide Supply Range: 2.7 V to 5.5 V
Small 8-Pin MSOP and 8-Pin SOIC Packages
2 Applications
Power-Supply Temperature Monitoring
Computer Peripheral Thermal Protection
Notebook Computers
Cell Phones
Battery Management
Office Machines
Thermostat Controls
Environmental Monitoring and HVAC
Electro Mechanical Device Temperature
3 Description
The TMP75 and TMP175 devices are digital temperature sensors ideal for negative temperature coefficient (NTC) and positive temperature coefficient (PTC) thermistor replacement. The devices offer a typical accuracy of ±1°C without requiring calibration or external component signal conditioning. Device temperature sensors are highly linear and do not require complex calculations or look-up tables to derive the temperature. The on-chip 12-bit analog-to- digital converter (ADC) offers resolutions down to 0.0625°C. The devices are available in the industry- standard LM75 SOIC-8 and MSOP-8 footprint.
The TMP175 and TMP75 feature SMBus, two-wire, and I2C interface compatibility. The TMP175 device allows up to 27 devices on one bus. The TMP75 allows up to eight on one bus. The TMP175 and TMP75 both feature an SMBus Alert function.
The TMP175 and TMP75 devices are ideal for extended temperature measurement in a variety of communication, computer, consumer, environmental, industrial, and instrumentation applications.
The TMP175 and TMP75 devices are specified for operation over a temperature range of −40°C to +125°C.
The TMP75 production units are 100% tested against sensors that are NIST traceable and are verified with equipment that are NIST traceable through ISO/IEC 17025 accredited calibrations.
Device Information
PART NUMBER | PACKAGE | BODY SIZE (NOM) |
TMPx75 | SOIC (8) | 4.90 mm × 3.91 mm |
VSSOP (8) | 3.00 mm × 3.00 mm |