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ENIG Multilayer PCB Fabrication , FR4 PCB Multi Circuit Boards 18 Layers High Frequency

Shenzhen Jingxin Electronic Technology Co., Ltd.
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[China] country

Address: F2 Building 13, F1/F2 Building 17 Hongfa Industrial Park, Tangtou Road, Shiyan, Baoan District, Shenzhen, China

Contact name:Kevin

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Shenzhen Jingxin Electronic Technology Co., Ltd.

ENIG Multilayer PCB Fabrication , FR4 PCB Multi Circuit Boards 18 Layers High Frequency

Country/Region china
City & Province shenzhen guangdong
Categories Electronics Production Machinery
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Product Details

High frequency ENIG Multilayer PCB Board Supply FR4 PCB Board 18 layers

 

JXE has over 16 years experience on electronics components purchasing area. 15 procurement engineers all have at least 5 years experience of components sourcing. We purchase components both from mainland China and overseas countries. JXE fast turnaround service combined with enhanced parts procurement system will cater to the customers who require both small volume and large volume production demands

 

18 layers Multilayer PCB board

 

The details include

1. PCB Gerber files.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

 

 

PCB Capacity

 

PCB General Capability
Number of Layer1 - 18 Layer
Maximum Processing Area680 × 1000MM
Min Board Thickness2 Layer - 0.3MM ( 12 mil )
4 Layer - 0.4MM ( 16 mil )
6 Layer - 0.8MM ( 32 mil )
8 Layer - 1.0MM ( 40 mil)
10 Layer - 1.1MM ( 44 mil )
12 Layer - 1.3MM ( 52 mil )
14 Layer - 1.5MM ( 59 mil )
16 Layer - 1.6MM ( 63 mil )
18 Layer - 1.8MM ( 71 mil )
Finished Board Thickness ToleranceThickness ≤ 1.0MM, Tolerance: ± 0.1MM
1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%
Twisting and Bending≤ 0.75%, Min: 0.5%
Range of TG130 - 215 ℃
Impedance Tolerance± 10%, Min: ± 5%
Hi-Pot TestMax: 4000V/10MA/60S
Surface TreatmentHASL, With Lead, HASL Free Lead
Flash Gold, Immersion Gold
Immersion Silver, Immersion Tin
Gold Finger, OSP
PCB Cu Thickness + Plating
Out Layer Cu Thickness1 - 6OZ
Inner Layer Cu Thickness0.5 - 4OZ
Cu Thickness of PTH20UM ≤ Average ≤ 25UM
Min: 18UM
HASL with LeadTin 63% Lead 37%
HASL Free Lead7UM ≤ Surface Thickness ≤ 12UM
Thick Gold PlatingNi Thickness: 3 - 5UM ( 120u" - 200u" )
Gold Thickness: 0.025 - 1.27UM ( 1u" - 50u" )
Immersion GoldNi Thckness: 3 - 5UM ( 120u" - 200u" )
Gold Thickness: 0.025 - 0.15UM ( 1u" - 3u" )
Immersion SilverAg Thickness: 0.15- 0.75 UM ( 6u" - 30u" )
Gold FingerNi Thickness: 3 - 5UM ( 120u" - 160u" )
Gold Thickness: 0.025 - 1.51UM ( 1u" - 60u" )
U940 PCB Pattern Limit Capability 
Min Width0.075MM ( 3 mil )
Min Trace0.075MM ( 3 mil )
Min Width of Ring ( Inner Layer )0.15MM ( 6 mil )
Min Width of Ring ( Out Layer )0.1MM ( 4 mil )
Min Solder Bridge0.1MM ( 4 mil )
Min Height of Legend0.7MM ( 28 mil )
Min Width of Legend0.15MM ( 6 mil )
PCB Holes Processing Capability
Final Hole SizeMin: Laser 0.1MM, Machine 0.2MM
Drilling Hole Size0.10 - 6.5MM
Drilling ToleranceNPTH: ±0.05MM, PTH: ±0.075MM
Final Hole Size Tolerance ( PTH )φ0.20 - 1.60MM ± 0.075MM
φ1.60 - 6.30MM ± 0.10MM
Final Hole Size Tolerance ( NPTH )φ0.20 - 1.60MM ± 0.05MM
φ1.60 - 6.50MM ± 0.05MM
Drilling Strip Hole-0L ~tu.'gth /width 2:1
Min Strip Hole Width 0.65MM
Length & Width Tolerance ± 0.05MM
Board Thickness / Hole Size≤ 10:1
PCB Cover Thickness Capability
Solder Mask ColorGreen,Matte Green,Yellow,Blue,Red,Black,Matte Black,White
Solder Mask ThicknessSurface Line ≥ 10UM
Surface Line Corner ≥ 6UM
Surface Board 10 - 25UM
Solder Mask Bridge Width
Legend ColorWhite,Yellow,Black
Min Height of Legend0.70MM ( 28 mil )
Min Width of Legend0.15MM ( 6 mil )
Blue Gel Thickness0.2 - 1.5MM
Blue Gel Tolerance±0.15MM
Carbon Print Thickness5 - 25UM
Carbon Print Min Space0.25MM
Carbon Print Impedance200Ω
Blind/Burried/Half Via PCB Capability 
Parameters

(1+1)e.g.

(4-layer)blind via:1-2,2-4

(6-layer)buried via:2-3,3-4

(8-layer)blind/buried:1-3,4-5,6-8

Min ViaLaser 0.1MM, Machine 0.2MM
Half ViaMin: 0.6MM
Impedance Capability
Resistance ValueSingle-ended 50 - 75Ω, Difference 100Ω, Coplanar 50 - 75Ω

 

 

PCB Photos

 

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