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Dicing Blade Grinding Wheel For Semiconductor And Photoelectricity Industry

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Metal & Resin Bond Dicing Blade

Ultra thin dicing blades are widely used in semiconducto industry

Features:

Specification:

Specifications:				Application
Common Shape	Wheel Size	Grit Size	Classic Specification	Industry	Workpiece&Material	Machine	Bond	Working Data
1A8, 1A1R	OD:10-200 T:0.07-2.0 H:6, 8, 12.7, 31.75,50.8	3um-70um		semiconductor industry optical glass industry optical communication	BGA, LGA, LED Blue glass, crystal, gem, filter quartz		Resin Metal

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