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CPU Processor Chip Core I3-6100H SR2FR I3 Series (3MB Cache,up to 2.7GHz ) - Notebook CPU
The Core i3-6100H is a dual-core processor based on the Skylake architecture, that
has been launched in September 2015. In addition to two CPU cores
with Hyper-Threading clocked at 2.7 GHz (no Turbo Boost), the chip
also integrates an HD Graphics 530 GPU and a dual-channel
DDR4-2133/DDR3L-1600 memory controller. The CPU is manufactured
using a 14 nm process with FinFET transistors.
| Processor number | i3-6100H |
| Family | Core i3 Mobile |
| Technology (micron) | 0.014 |
| Processor speed (GHz) | 2.7 |
| L2 cache size (KB) | 512 |
| L3 cache size (MB) | 3 |
| The number of cores | 2 |
| EM64T | Supported |
| HyperThreading technology | Supported |
| Virtualization technology | Supported |
| Enhanced SpeedStep technology | Supported |
| Execute-Disable bit feature | Supported |
General Information:
| Type | CPU / Microprocessor |
| Market segment | Mobile |
| Family | Intel Core i3 Mobile |
| Model number | i3-6100H |
| CPU part number | § CL8066202194634 is an OEM/tray microprocessor |
| Frequency | 2700 MHz |
| Bus speed | 8 GT/s DMI |
| Clock multiplier | 27 |
| Package | 1440-ball micro-FCBGA |
| Socket | BGA1440 |
| Size | 1.65" x 1.1" / 4.2cm x 2.8cm |
| Introduction date | September 1, 2015 (announcement) September 1, 2015 (availability in Asia) September 27, 2015 (availability elsewhere) |
Architecture Microarchiteture:
| Microarchitecture | Skylake |
| Processor core | Skylake-H |
| Core stepping | R0 (SR2FR) |
| Manufacturing process | 0.014 micron |
| Data width | 64 bit |
| The number of CPU cores | 2 |
| The number of threads | 4 |
| Floating Point Unit | Integrated |
| Level 1 cache size | 2 x 32 KB 8-way set associative instruction caches 2 x 32 KB 8-way set associative data caches |
| Level 2 cache size | 2 x 256 KB 4-way set associative caches |
| Level 3 cache size | 3 MB shared cache |
| Physical memory | 64 GB |
| Multiprocessing | Not supported |
| Features | § MMX instructions § SSE / Streaming SIMD Extensions § SSE2 / Streaming SIMD Extensions 2 § SSE3 / Streaming SIMD Extensions 3 § SSSE3 / Supplemental Streaming SIMD Extensions 3 § SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 § AES / Advanced Encryption Standard instructions § AVX / Advanced Vector Extensions § AVX2 / Advanced Vector Extensions 2.0 § BMI / BMI1 + BMI2 / Bit Manipulation instructions § F16C / 16-bit Floating-Point conversion instructions § FMA3 / 3-operand Fused Multiply-Add instructions § EM64T / Extended Memory 64 technology / Intel 64 § NX / XD / Execute disable bit § HT / Hyper-Threading technology § VT-x / Virtualization technology § VT-d / Virtualization for directed I/O § TSX / Transactional Synchronization Extensions § MPX / Memory Protection Extensions § SGX / Software Guard Extensions |
| Low power features | Enhanced SpeedStep technology |
Integrated peripherals / components:
| Display controller | 3 displays |
| Integrated graphics | GPU Type: HD 530 Graphics tier: GT2 Microarchitecture: Gen 9 Execution units: 24 Base frequency (MHz): 350 Maximum frequency (MHz): 900 |
| Memory controller | The number of controllers: 1 Memory channels: 2 Supported memory: DDR3L-1600, LPDDR3-1866, DDR4-2133 Maximum memory bandwidth (GB/s): 34.1 |
| Other peripherals | § Direct Media Interface 3.0 § PCI Express 3.0 interface (16 lanes) |
Electrical / Thermal parameters:
| Maximum operating temperature | 100°C |
| Thermal Design Power | 35 Watt |
