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High Resolution CMOS Camera Sensor Module 50mp Sony IMX766 Mipi

Guangzhou Sincere Information Technology Ltd.

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High Resolution CMOS Camera Sensor Module 50mp Sony IMX766 Mipi

Country/Region china
City & Province guangzhou
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Product Details

High Resolution CMOS Camera Sensor Module 50mp Sony IMX766 Mipi

 

 

Specificaitons

 

Model No.SF-C0QS01 IMX766
SensorSony IMX766
Pixel50MP
Focusing Range10cm-Infinity
Focal Length2.92mm
Customized SupportOEM, ODM
Product TypeMIPI Camera Module
Customized SupportOEM, ODM
Warranty10 Years
Replacement1 Year

 

 

Description

 

The 50MP Sony IMX766 comes with a 1/1.56-inch sensor size and supports OIS. It adopts Sony's back-illuminated and stacked CMOS image sensor to achieve high speed image capturing by column parallel A/D converter circuits and high sensitivity and low noise image (comparing with conventional CMOS image sensor) through the backside illuminated imaging pixel structure. R, G, and B pigment primary color mosaic filter is employed. It operates with four power supply voltages: analog 2.8V and 1.8V, digital 1.1 V and 1.8 V for input/output interface and achieves low power consumption.

 

 

Features

 

The IMX766 is a 50MP resolution image sensor with a sensor size of 1/1.56” and a pixel size of 1.0μm. The large sensor size combined with increased pixel size offers higher light intake compared to previous Sony sensors.
The sensor is based on Sony’s 2x2 On-Chip Lens (OCL) solution that utilizes a condenser lens on top of four adjacent pixels in a Quad Bayer color filter array. Such a mechanism allows detecting phase differences across all pixels and enables high accuracy for small objects. This also boosts focus performance in low-light conditions.

 

 

 

Device Structure

 

CMOS Image Sensor

Image Size: Diagonal 10.240 mm (Type 1/1.56)

Number of effective pixels: 8224 (H) × 6224 (V) approx. 51.1 M pixels

Number of active pixels: 8192 (H) × 6144 (V) approx. 50.3 M pixels

Chip size: 9.214 mm (H) × 7.270 mm (V)

Unit cell size: 1.00 μm (H) × 1.00 μm (V)

Substrate material: Silicon

 

 

Applicaitons

 

Camera Solutions
Infrared Imagers For Industry

Drone Camera Module
Intelligent Systems, etc.

 

 

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