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Wangling TP-1/2 High Frequency Printed Circuit Board Alternative High DK RF PCB DK10, DK22 Circuit Board

Shenzhen Bicheng Electronics Technology Co., Ltd
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Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China

Contact name:Sally Mao

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Shenzhen Bicheng Electronics Technology Co., Ltd

Wangling TP-1/2 High Frequency Printed Circuit Board Alternative High DK RF PCB DK10, DK22 Circuit Board

Country/Region china
City & Province shenzhen guangdong
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Product Details

DK 10 High Frequency PCB on Microwave Composite Dielectric Material TP-1/2 Microwave Printed Circuit Board

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

TP-1/2 is smooth and neat on both sides, no stain, scratch and dent on overall appearance. The chemical etching method used on PCB manufacturing result in stable dielectric properties. The dielectric constant is stable and DK can be optional within the range of 3 to 22 according to the design of circuit requirement. The operating temperature is -100℃~+150℃.

 

The peel strength between the copper and the substrate is more reliable than the vacuum film coating of ceramic substrate. This substrate is designed to offer customers easy circuit processing, higher pass-rate of production. Especially, the manufacturing cost is much lower than the ceramic substrate.

 

Typical Applications

1.Aircraft Collision Avoidance Systems

2.GPS Antennas

3.Microstrip Patch Antennas

4.Passive Components (filters, couplers, power dividers)

5.Satellite Components

 

 

Our Capability (TP-1/2)

PCB Material:Microwave Composite Dielectric Material
Designation:TP-1/2
Dielectric constant:10.0
Dissipation Factor0.001 10GHz
Layer count:Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:0.8mm±0.05, 1.0mm±0.05, 1.2mm±0.05, 1.5mm±0.06, 2.0mm±0.075, 3.0mm±0.1, 4.0mm±0.1, 5.0mm±0.12, 6.0mm±0.12, 10.0mm±0.2
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

 

Why Choose Us?

1.ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;

2.More than 18+ years’ high frequency PCB experience;

3.Small quantity order is available, no MOQ required;

4.We’re a Team of passion, discipline, responsibility and honesty;

5.Delivery on time: >98%, Customer complaint rate: <1%

6.16000㎡ workshop, 30000㎡ output a month and 8000 types of PCB's a month;

7.Powerful PCB capabilities support your research and development, sales and marketing;

8.IPC Class 2 / IPC Class 3

 

TP-1/2 Typical Value

NameTest conditionUnitValue
DensityNormal stateg/cm31.0~2.9
Moisture AbsorptionDip in distilled water of 20±2 for 24 hours%≤0.02
Peel strengthIn normal stateN/cm≥6
In the environment of alternating humidity and temperature:N/cm≥4
Operating TemperatureHigh-low temperature cabinet-100+150(Processing temperature should not exceed 200℃)
Thermal Conductivity-55~288W /m /k0.6
CTETemperature rise of 96 per hour < 6×10-5
Shrinkage Factor2 hours in boiling water%0.0004
Surface Resistivity500V DC Normal stateM.Ω≥1×107
500V DC Constant humidity and temperatureM.Ω≥1×105
Volume ResistivityNormal stateMΩ.cm≥1×109
Constant humidity and temperature ≥1×106
Surface dielectric strengthNormal stateKv/mm≥1.5
Constant humidity and temperature ≥1.2
Dielectric Constant10GHzεr3, 6, 9.6, 10.2, 10.5, 11, 16, 20, 22(±2%)(DK can be customized)
Dissipation Factor10GHzTgδ(εr 3-11)≤1×10-3
Tgδ(εr 12-22)≤1.5×10-3

 

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