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Rogers RO4003C PCB Double Sided 8mil 0.203mm RF High Frequency PCB for Antenna

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Shenzhen Bicheng Electronics Technology Co., Ltd

Rogers RO4003C PCB Double Sided 8mil 0.203mm RF High Frequency PCB for Antenna

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Product Details

Rogers 4003 8mil 0.203mm RF PCB RO4003C High Frequency PCB Double Sided for Antenna

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Introduction of RO4003C material

RO4003C hydrocarbon ceramic laminates are designed to offer superior high frequency performance and low cost circuit fabrication. The selection of laminates typically available to designers is significantly reduced once operational frequencies increase to 500 MHz and above. RO4003C material possesses the properties needed by designers of RF microwave circuits and matching networks and controlled impedance transmission lines. Low dielectric loss allows RO4003C material to be used in many applications where higher operating frequencies limit the use of conventional circuit board materials. The temperature coefficient of dielectric constant is among the lowest of any circuit board material, and the dielectric constant is stable over a broad frequency range. RO4003C material's thermal coefficient of expansion(CTE) provides several key benefits to the PCB designers. The expansion coefficient of RO4003C is similar to that of copper which allows the material to exhibit excellent dimensional stability, a property needed for mixed dielectric multi-layer boards constructions. The low Z-axis CTE of RO4003C provides reliable plated through-hole quality, even in severe thermal shock applications. RO4003C material has a Tg of >280C so its expansion characteristics remain stable over the entire range of PCB processing temperatures.

 

 

PCB Specifications

PCB SIZE58 x 110mm=1up
BOARD TYPEDouble sided PCB
Number of Layers2 layers
Surface Mount ComponentsYES
Through Hole ComponentsNO
LAYER STACKUPcopper ------- 35um(1 oz)+plate TOP layer
RO4003C 0.203mm
copper ------- 35um(1oz) + plate BOT Layer
TECHNOLOGY 
Minimum Trace and Space:6 mil / 11 mil
Minimum / Maximum Holes:0.4 mm / 0.4 mm
Number of Different Holes:1
Number of Drill Holes:3
Number of Milled Slots:0
Number of Internal Cutouts:0
Impedance Control:no
Number of Gold finger:0
BOARD MATERIAL 
Glass Epoxy:RO4003C Tg280℃, er<3.48, Rogers Corp.
Final foil external:1.5 oz
Final foil internal:N/A
Final height of PCB:0.3 mm ±0.1
PLATING AND COATING 
Surface FinishImmersion gold, 19.5%
Solder Mask Apply To:N/A
Solder Mask Color:N/A
Solder Mask Type:N/A
CONTOUR/CUTTINGRouting
MARKING 
Side of Component LegendN/A
Colour of Component LegendN/A
Manufacturer Name or Logo:N/A
VIAPlated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATINGN/A
DIMENSION TOLERANCE 
Outline dimension:0.0059"
Board plating:0.0029"
Drill tolerance:0.002"
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.

 

 

Typical applications are as follows:

Automotive Radar and Sensors

Cellular Base Station Antennas

Direct Broadcast Satellites

Low Noise Block

Power amplifiers

RFID

 

 

Data Sheet of Rogers 4003C (RO4003C)

RO4003C Typical Value
PropertyRO4003CDirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.38±0.05Z 10 GHz/23IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3.55Z 8 to 40 GHzDifferential Phase Length Method
Dissipation Factortan,δ0.0027
0.0021
Z 10 GHz/23
2.5 GHz/23
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε+40Zppm/-50to 150IPC-TM-650 2.5.5.5
Volume Resistivity1.7 x 1010 MΩ.cmCOND AIPC-TM-650 2.5.17.1
Surface Resistivity4.2 x 109 COND AIPC-TM-650 2.5.17.1
Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
Tensile Modulus19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi)RTASTM D 638
Tensile Strength139(20.2)
100(14.5)
X
Y
MPa(ksi)RTASTM D 638
Flexural Strength276
(40)
 MPa
(kpsi)
 IPC-TM-650 2.4.4
Dimensional Stability<0.3X,Ymm/m
(mil/inch)
after etch+E2/150IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion11
14
46
X
Y
Z
ppm/-55to288IPC-TM-650 2.4.41
Tg>280  TMAAIPC-TM-650 2.4.24.3
Td425  TGA ASTM D 3850
Thermal Conductivity0.71 W/M/oK80ASTM C518
Moisture Absorption0.06 %48hrs immersion 0.060"
sample Temperature 50
ASTM D 570
Density1.79 gm/cm323ASTM D 792
Copper Peel Stength1.05
(6.0)
 N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
FlammabilityN/A   UL 94
Lead-free Process CompatibleYes    

 

 
 

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