Active Member
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[China]
Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Contact name:Sally Mao
Shenzhen Bicheng Electronics Technology Co., Ltd |
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Arlon Microwave PCB Built on AD450 70mil 1.778mm DK4.5 With Immersion Gold for Circuit Board Miniaturization
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Rogers' (Arlon) AD450 is a woven fiberglass reinforced, ceramic filled, PTFE based composite material for use as a printed circuit board substrate. The woven fiberglass provides better dielectric constant and thickness uniformity, better dimensional stability as well as reduced manufacturing costs.
The electrical properties of AD450 suggest it can readily replace FR-4 in applications where higher frequencies and expectations for increased fidelity with broadband signal are beyond the performance offered by FR-4.
With a dielectric constant of 4.5, most FR-4 designs can be readily transferred. Its higher thermal conductivity and lower CTE also promote its use in higher power designs, where temperature extremes and heat rejection are primary considerations.
AD450 is compatible with processing used for standard PTFE based printed circuit board substrates. In addition, its low Z-axis thermal expansion will improve plated through hole reliability, compared to typical PTFE based laminates.
Typical Applications:
1. Circuit Board Miniaturization
2. Multimedia Transmission Systems
3. Wide Band Antenna Applications
4. Replacement of FR-4 in Higher Frequency Applications
Figure 1 demonstrates the stability of dielectric constant across frequency.
Figure 2 demonstrates the stability of dissipation factor across frequency.
Our PCB Capability(AD450)
| PCB Material: | Woven Fiberglass Re inforced, Ceramic filled, PTFE based Composite |
| Designation: | AD450 |
| Dielectric constant: | 4.5 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 20mil (0.508mm), 30mil(0.762mm), 40mil(1.016mm), 50mil (1.27mm), 60mil (1.524mm), 70mil(1.778mm), 90mil (2.286mm), 180mil (4.572mm), 200mil (5.08mm), 230mil (5.842mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
Data Sheet of AD450
| Property | Test Method | Condition | Result |
| Dielectric Constant @ 200 MHz | IPC TM-650 2.5.5.6 | C23/50 | 4.5 |
| Loss Tangent @ 10 GHz | IPC TM-650 2.5.5.6 | C23/50 | 0.0035 |
| Thermal Coefficient of Er | IPC TM-650 2.5.5.6 | - 10℃ TO +140℃ | -233.5 |
| Copper Peel Strength (lb/in) | IPC TM-650 2.4.8 | A, TS | >12 |
| Volume Resistivity (MΩ-cm) | IPC TM-650 2.5.17.1 | C96/35/90 | 1.2 X 109 |
| Surface Resistivity (MΩ) | IPC TM-650 2.5.17.1 | C96/35/90 | 4.5 X 107 |
| Arc Resistance (seconds) | ASTM D-495 | D48/50 | >180 |
| Tensile Modulus (kpsi) | ASTM D-638 | A, 23℃ | >700 |
| Tensile Strength (kpsi) | ASTM D-882 | A, 23℃ | >20 |
| Compressive Modulus (kpsi) | ASTM D-685 | A, 23℃ | >350 |
| Flexural Modulus (kpsi) | ASTM D-790 | A, 23℃ | >540 |
| Dielectric Breakdown (kV) | ASTM D-149 | D48/50 | >45 |
| Density (g/cm3) | ASTM D-792 Method A | A, 23℃ | 2.45 |
| Water Absorption (%) | IPC TM-650 2.6.2.2 | E1/105 + D24/23 | 0.07 |
| Coefficient of Thermal Expansion (ppm/℃) X Axis Y Axis Z Axis | IPC TM-650 2.4.24 TMA | 0℃ to 100 ℃ | 8 11 42 |
| Thermal Conductivity (W /mK) | ASTM E-1225 | 100℃ | 0.38 |
| Outgassing Total Mass Loss (%) Collected Volatile Condensable Material (%) Water Vapor Recovered | NASA SP-R-0022A Maximum 1.00% Maximum 0.10% | 125℃, ≦10-6 torr | 0.01 0.01 0.00 |
| Flammability | UL 94 Vertical Burn | C48/23/50, E24/125 | UL94-V0 |
