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Fast PCB Quick Turn Prototype 4-layer Circuit Board Built On FR-4 With 2oz and Immersion Gold

Shenzhen Bicheng Electronics Technology Co., Ltd
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Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China

Contact name:Sally Mao

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Shenzhen Bicheng Electronics Technology Co., Ltd

Fast PCB Quick Turn Prototype 4-layer Circuit Board Built On FR-4 With 2oz and Immersion Gold

Country/Region china
City & Province shenzhen guangdong
Categories Electronics Production Machinery
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Product Details

Fast PCB Quick Turn Prototype 4-layer Circuit Board Built On FR-4 With 2oz and Immersion Gold

(Printed circuits boards are custom-made products, the picture and parameters shown are just for reference)

 

1.1 General description

This is a type of fast lead time required multilayer PCB built on FR-4 substrate with Tg 150°C for the application of Power Supply Switch. It's standard 1.60 mm thick, white silkscreen over green solder mask covers both sides. This is a power board, each layer true 2oz applied and thicker gold 4 micro inches are plated on the pads. The base material is used from ITEQ IT-158, entire board supplying 1 up PCB. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 panels are packed for shipment.

 

1.2 Features and benefits

1. Middle Tg PCB Shows outstanding thermal resistance and suitable for lead-free process;

2. Very Low Moisture Absorption and better CAF resistance;

3. Gold has good oxidation resistance and good heat dissipation;

4. Gold has long storage time, it can be stored for more than 1 year in vacuum bag;

5. Competitive price and On-time service;

6. ISO9001, ISO14001, ISO13485, UL certified manufacturing factory;

7. More than 18+ years of PCB experience;

8. Customer complaint rate: <1%

9. Door to door shipment service;

 

 

1.3 PCB Specifications

PCB SIZE78 x 65mm=1PCS
BOARD TYPEMultilayer PCB
Number of Layers4 layers
Surface Mount ComponentsYES
Through Hole ComponentsYES
LAYER STACKUPcopper ------- 70um(2oz)+plate TOP layer
Prepreg 7628 0.195mm
copper ------- 70um(2oz) MidLayer 1
FR-4 0.2mm
copper ------- 70um(1oz) MidLayer 2
Prepreg 7628 0.195mm
copper ------- 70um(2oz)+plate BOT layer
TECHNOLOGY 
Minimum Trace and Space:11.81 mil / 7.8 mil
Minimum / Maximum Holes:0.5 mm / 3.5 mm
Number of Different Holes:7
Number of Drill Holes:125
Number of Milled Slots:NO
Number of Internal Cutouts:NO
Impedance Control:NO
Number of Gold finger:NO
BOARD MATERIAL 
Glass Epoxy:FR-4 Tg150℃, er<5.4.IT-158, ITEQ Supplied
Final foil external:2 oz
Final foil internal:2 oz
Final height of PCB:1.6 mm ±0.16
PLATING AND COATING 
Surface FinishImmersion gold (32.1% ) 0.1µm over 3µm nickel
Solder Mask Apply To:TOP and Bottom, 14 micron Minimum
Solder Mask Color:Green, PSR-2000GT600D, Taiyo Supplied.
Solder Mask Type:LPSM
CONTOUR/CUTTINGRouting
MARKING 
Side of Component LegendTOP and Bottom.
Colour of Component LegendWhite, IJR-4000 MW300, Taiyo brand
Manufacturer Name or Logo:Marked on the board in a conductor and leged FREE AREA
VIAPlated through hole(PTH), minimum size 0.5 mm.
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
DIMENSION TOLERANCE 
Outline dimension:0.0059"
Board plating:0.0029"
Drill tolerance:0.002"
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.

 

1.4 Applications

Radar Detector

Multiplexer

Embedded System

Wireless Alarm

5G Booster

Peripheral Device

Mobile Modem

RF Amplifiers

Balanced Mixer

Relays (automotive and industrial)

 

 

1.5 Capability of Fast Delivery

TypesNormal Lead time (1)Fast Lead Time (1)
2L5 Days1 Day
4L5 Days2 Days
6L6 Days3 Days
8L7 Days4 Days
10L9 Days6 Days
12L10 Days6 Days
14L13 Days7 Days
16L14 Days7 Days
18L15 Days9 Days
20L16 Days10 Days
22L17 Days11 Days
24L18 Days12 Days
26L19 Days13 Days
28L20 Days14 Days
30L21 Days15 Days
32L22 Days16 Days
>32 LayersPendingPending
 
Note:
1.The lead time is for new order
2.Exclude Sunday, holidays
3.There's Order limitation every day.
4.Exclude shipping time
5.Exclude special technics, such as heavy copper, peelable mask, blind/buried via etc.
6.Exclude communications for engineering questions.

 

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