Shenzhen WonDa Technology Co., Ltd. |
Verified Suppliers
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electronic ballast pcb/pcb design/pcb scrap
1.Competitive price
2.Prompt Reply&Delivery
3.High quality,Best service
4ISO9001/TS16949/ROHS
We are professional manufacturer in various PCB and PCBA with many years experience,We can provide a reasonable price with high quality products.
* 1. PCB layout, PCB design
* 2: Make high difficulty PCB(1 to 38 layers)
* 3: Provide all Electronic components
* 4: PCB assembly
* 5: Write programs for clients
* 6: PCBA/finished product Test. etc.
PCB Specification detail
Item | Specification | |
1 | Numbr of Layer | 1-38Layers |
2 | Material | FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic , crockery Metal-backed Laminate |
3 | Finish Board Thickness | 0.2mm-6.00 mm(8mil-126mil) |
4 | Minimun Core Thickness | 0.075mm(3mil) |
5 | Copper Thickness | 1/2 oz min;12 oz max |
6 | Min.Trace Width & Line Spacing | 0.075mm/0.1mm(3mil/4mil) |
7 | Min.Hole Diameter for CNC Driling | 0.1mm(4mil) |
8 | Min.Hole Diameter for punching | 0.9mm(35mil) |
9 | Biggest panel size | 610mm*508mm |
10 | Hole Positon | +/-0.075mm(3mil) CNC Driling |
11 | Conductor Width(W) | +/-0.05mm(2mil)or |
20% of original artwork | ||
12 | Hole Diameter(H) | PTH L:+/-0.075mm(3mil) |
Non-PTH L:+/-0.05mm(2mil) | ||
13 | Outline Tolerance | +/-0.125mm(5mil) CNC Routing |
+/-0.15mm(6mil) by Punching | ||
14 | Warp & Twist | 0.70% |
15 | Insulation Resistance | 10Kohm-20Mohm |
16 | Conductivity | <50ohm |
17 | Test Voltage | 10-300V |
18 | Panel Size | 110×100mm(min) |
660×600mm(max) | ||
19 | Layer-layer misregistration | 4 layers:0.15mm(6mil)max |
6 layers:0.25mm(10mil)max | ||
20 | Min.spacing between hole edge to circuity pqttern of an inner layer | 0.25mm(10mil) |
21 | Min.spacing between board oulineto circuitry pattern of an inner layer | 0.25mm(10mil) |
22 | Board thickness tolerance | 4 layers:+/-0.13mm(5mil) |
6 layers:+/-0.15mm(6mil) | ||
23 | Impedance Control | +/-10% |
24 | Different Impendance | +-/10% |
Details for PCB Assembly
Technical
1).Professional surface mounting and through hole soldering technology;
2).Various sizes,like 1206,0805,0603 components SMT technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;
4).Nitrogen gas reflow soldering technology for SMT;
5).High standard SMT&Solder Assembly line;
6).High density interconnected board placement technology capacity.
Quote requirement
1).The detailed files(Gerber files,specification and BOM);
2).Clear pictures of PCBA or samples for us;
3).PCBA Test method.