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64g ddr sdrams vfbga 153

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Results for64g ddr sdrams vfbga 153from 787 Products.
IS46LD32320A-3BPLA25 Memory IC Chip

IS46LD32320A-3BPLA25 Memory IC Chip

Apr,11,2024
IS46LD32320A-3BPLA25 Specifications Part Status Discontinued at Digi-Key Memory Format RAM Memory Type Mobile LPDDR2-S4 SDRAM Memory Size 1G (32M x 32) Speed 333MHz Interface ...
china
KZ TECHNOLOGY (HONGKONG) LIMITED
Member
DRAM Dynamic Random Access Memory 32G MT53D1024M32D4DT-053 AIT:D

DRAM Dynamic Random Access Memory 32G MT53D1024M32D4DT-053 AIT:D

Apr,11,2024
MT53D1024M32D4DT-053 AIT:D Micron DRAM LPDDR4 32G 1GX32 FBGA QDP VFBGA-200 MT53D1024M32D4DT-053 AIT:D TR MT53D1024M32D4DT-053 AAT:D MT53D1024M32D4DT-053 AAT:D TR Manufacturer: ...
Guangdong, china
Eastern Stor International Ltd.
Verified
OEM Smart Touch Screen Self Service Kiosk Bill QR Cash Card Payment Checkout

OEM Smart Touch Screen Self Service Kiosk Bill QR Cash Card Payment Checkout

Apr,11,2024
OEM Smart Touch Screen Self Service Kiosk Bill QR Cash Card Payment Checkout Machine Cashier Register Product Quick Information A Grade A+ Panel PCAP Touch HD Resolution 1366x768 ...
china
Shenzhen Chuangli Technology Co., Ltd.
Verified
PARALLEL Merrillchip Micron ISSI Samsung IC DRAM 4GBIT MT41K256M16TW-107 IT:P

PARALLEL Merrillchip Micron ISSI Samsung IC DRAM 4GBIT MT41K256M16TW-107 IT:P

Apr,11,2024
Merrillchip Hot sale IC chips IC DRAM 4GBIT PARALLEL Integrated circuit Flash memory EEPROM DDR EMMC MT41K256M16TW-107 I MT41K256M16TW-107 IT:P DDR3 SDRAM uses a double data rate ...
china
ShenZhen QingFengYuan Technology Co.,Ltd.
Verified
Android 10 Smart TV Stick RK3229 Quad Core H.265 4K 60Hz Media Streaming Device

Android 10 Smart TV Stick RK3229 Quad Core H.265 4K 60Hz Media Streaming Device

Apr,11,2024
RK3229 Quad core H.265 4K 60Hz Smart Android 10 TV Stick Streaming Media Model No: CX-939 Plus Hardware Spec Operation System Android 10 Language Chinese,English...Multi-Language ...
Guangdong, china
SHENZHEN SUNCHIP TECHNOLOGY CO., LTD
Verified
Tenting process 25um DRAM IC package Substrate BT material 4 Layer

Tenting process 25um DRAM IC package Substrate BT material 4 Layer

Apr,11,2024
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
IS46LD32320A-3BPLA25-TR Memory IC Chip

IS46LD32320A-3BPLA25-TR Memory IC Chip

Apr,11,2024
IS46LD32320A-3BPLA25-TR Specifications Part Status Discontinued at Digi-Key Memory Format RAM Memory Type Mobile LPDDR2-S4 SDRAM Memory Size 1G (32M x 32) Speed 333MHz Interface ...
china
KZ TECHNOLOGY (HONGKONG) LIMITED
Member
NAND/FLASH Memory Ic packaging Substrate

NAND/FLASH Memory Ic packaging Substrate

Apr,11,2024
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
S40410081B1B1W000 Memory IC Chip

S40410081B1B1W000 Memory IC Chip

Apr,11,2024
S40410081B1B1W000 Specifications Part Status Obsolete Memory Format FLASH Memory Type Non-Volatile Memory Size 8Gb (1G x 8) Speed 200MHz Interface Parallel Voltage - Supply 2.7 V ~ ...
china
KZ TECHNOLOGY (HONGKONG) LIMITED
Member
4layer BT material Sip Packaging Substrate Semiconductor package

4layer BT material Sip Packaging Substrate Semiconductor package

Apr,11,2024
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
MT46V32M16CV-5B IT:J Memory IC Chip

MT46V32M16CV-5B IT:J Memory IC Chip

Apr,11,2024
MT46V32M16CV-5B IT:J Specifications Part Status Active Memory Format RAM Memory Type DDR SDRAM Memory Size 512M (32M x 16) Speed 200MHz Interface Parallel Voltage - Supply 2.5 V ~ ...
china
KZ TECHNOLOGY (HONGKONG) LIMITED
Member
25um BGA FBGA Package Substrate For Memory ic packaging

25um BGA FBGA Package Substrate For Memory ic packaging

Apr,11,2024
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
Semiconductor FR4 FBGA IC Packaging Substrate 1-6 layer

Semiconductor FR4 FBGA IC Packaging Substrate 1-6 layer

Apr,11,2024
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
FBGA/PBGA/LGA Package Semiconductor Substrate manufacture

FBGA/PBGA/LGA Package Semiconductor Substrate manufacture

Apr,11,2024
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
FBGA/PBGA/LGA Package Semiconductor Substrate Manufacture

FBGA/PBGA/LGA Package Semiconductor Substrate Manufacture

Apr,11,2024
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
FCBGA/BGA package substrate manufacture

FCBGA/BGA package substrate manufacture

Apr,11,2024
Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
semiconductor FCCSP package substrate manufacture in HOREXS

semiconductor FCCSP package substrate manufacture in HOREXS

Apr,11,2024
Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
FCBGA/BGA package substrate manufacture

FCBGA/BGA package substrate manufacture

Apr,11,2024
Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
MEMS package substrate manufacture

MEMS package substrate manufacture

Apr,11,2024
Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
System in package Sip package substrate manufacture

System in package Sip package substrate manufacture

Apr,11,2024
Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
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