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4 layer pop package substrate

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Results for4 layer pop package substratefrom 20375 Products.
FCBGA/BGA package substrate manufacture

FCBGA/BGA package substrate manufacture

Apr,11,2024
Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
semiconductor FCCSP package substrate manufacture in HOREXS

semiconductor FCCSP package substrate manufacture in HOREXS

Apr,11,2024
Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
FCBGA/BGA package substrate manufacture

FCBGA/BGA package substrate manufacture

Apr,11,2024
Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
MEMS package substrate manufacture

MEMS package substrate manufacture

Apr,11,2024
Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
FCCSP Flipchip package substrate manufacture

FCCSP Flipchip package substrate manufacture

Apr,11,2024
Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
HOREXS semiconductor ic package substrate With Chip Wire Bonding

HOREXS semiconductor ic package substrate With Chip Wire Bonding

Apr,11,2024
Application:Memory card,UDP,bonding PCB printed circuit boards;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
4L build up types 0.8mm Gold Surface IC Package Substrate

4L build up types 0.8mm Gold Surface IC Package Substrate

Apr,11,2024
Application:Dram memory electronics,IC card,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
Semiconductor Package Substrate 12um copper buildup types

Semiconductor Package Substrate 12um copper buildup types

Apr,11,2024
Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
25um BT IC Package Substrate Soft gold plating

25um BT IC Package Substrate Soft gold plating

Apr,11,2024
Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
4layer BT material Sip Packaging Substrate Semiconductor package

4layer BT material Sip Packaging Substrate Semiconductor package

Apr,11,2024
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
NAND/FLASH Memory Ic packaging Substrate

NAND/FLASH Memory Ic packaging Substrate

Apr,11,2024
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
25um BGA FBGA Package Substrate For Memory ic packaging

25um BGA FBGA Package Substrate For Memory ic packaging

Apr,11,2024
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
semiconductor FCCSP Package Substrate manufacture

semiconductor FCCSP Package Substrate manufacture

Apr,11,2024
Application:FCCSP package,IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
MicroLED/MniLED package substrate manufacture

MicroLED/MniLED package substrate manufacture

Apr,11,2024
High Precision Fine Pitch LED package substrate with Plating Silver 0.4mm finished BT thickness,ROHS passed Application:Led lighting,LED display,LED displays,Outdoor LED pcb...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
BT semiconductor IC packaging substrate manufacture

BT semiconductor IC packaging substrate manufacture

Apr,11,2024
Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
Flash/NAND memory package substrate production

Flash/NAND memory package substrate production

Apr,11,2024
Application:Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
Multilayer BT materials semiconductor package substrate manufacture

Multilayer BT materials semiconductor package substrate manufacture

Apr,11,2024
Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
LED chip ic package substrate manufacture supporting

LED chip ic package substrate manufacture supporting

Apr,11,2024
Application:Semi Package,LED chip package,Semiconductors ,Semiconductor,IC package,miniLED,MicroLED,MEMS,IC assembly,Storage IC substrage; Spec.of substrate production: Mini.Line ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
microelectronics package substrate manufacture

microelectronics package substrate manufacture

Apr,11,2024
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory,Microelectronics assembly,Microelectronics package; Spec.of substrate production: Mini.Line space...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
Horexs Ultra thin MEMS package substrate manufacture supporting

Horexs Ultra thin MEMS package substrate manufacture supporting

Apr,11,2024
Ultrathin MEMS PCB which have Capacitor and Resistor in it Application:MEMS semiconductor,MEMS package,MEMS,CMOS,IC substrate,acoustics electronics,pressure electronics ,others; ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
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