3 0 g cc thermally conductive gap filler pads

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RoHS 2.5 KN/M Thermal Isolation Pads GPU 3 mm Weather Resistant

Apr,11,2024

1.0W/m.K Thermal Conductivity Ultra Soft Thermal Pad Cooling Gap Filling Materials Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced Fiberglass - ...

Guangdong, china

Shenzhen Aochuan Technology Co., Ltd

Verified

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