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Full Automatic BGA Rework Station 220V 110V Hot Air IR Reballing Machine

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[China]

Address: Building 7, No. 6, West Industrial Zone, Hosi, Xihuan Road, Shajing Street, Baoan District, Shenzhen, Guangdong

Contact name:Jack Du

Shenzhen Wisdomshow Technology Co.,ltd

Full Automatic BGA Rework Station 220V 110V Hot Air IR Reballing Machine

Country/Region	china
City & Province	shenzhen guangdong
Categories	Other Welding Equipment

Product Details

WDS-1250 full auto BGA rework station server motherboard repair machine hot air IR reballing welding machine

Application Domain

WDS-A1250 its designed for big size industrial control motherboard&5Gservice motherboard repairing(PCB repair maximum size:1200mmX700mm),all operation is control by computer.Equipped HD optical alignment system,hot air+IR+gas which heating way is 3 in 1(include nitrogen or compressed air).All in one BGA rework station which all movement actions are made of electric motor drive and software control.Suit for removing or soldering any kind of seal chips and BGA chips,any special or difficult chips POP, CCGA,BGA,QFN,CSP, LGA,Micro SMD,MLF(Micro Lead Frames) .

Product Description

Power supply	AC 110V/220V±10% 50/60Hz
Total power	Max 10400W
Heater power	Upper heater 1200W,bottom heater 1200W,IR heater 8000W MAX
Locating way	Optical camera+ V-shape card slot + adjustable PCB support jigs + laser position for fast location
Temperature controlling	(high precision K-sensor)(Closed Loop),independent temp.controller,the precision can reach ±1℃
Electrical material	Servo motor + PLC control + smart temp.controller + high sensitive touch screen IPC
PCB size	Max 1200×700mm Min 10×10 mm(customizable)
Applicable PCB thickness	0.3-8mm
Chip amplification multiple	1-200X
Chip size	*Max 120120mm, Min 0.60.6mm*
Min. chip space	0.15mm
Max. mount loading	300G
Mounting accuracy	±0.01mm
Alignment system	Optical lens + HD industrial camera
Temperature Interface	13pcs
Tin spot monitoring	Side camera used for monitoring solder ball melting in soldering process
Degree of Automation	Upper heater and CCD camera can be removed front and back,left and right both,prevent the dead angle
Overall dimension	L1350×W1300×H1920mm
Weight	650KG

Detailed Images

● Independent ten axis interlock,ten electric motor drive control all movement.Up&down temperature zone/PCB movement and optical alignment system X/Y movement all can control by computer,easy operation.Machine can store more than 5000 groups of temperature profile,suit for large quantities motherboard rework,increase the work efficiency,high-level automatic;server motherboard repair machine

● X, Y direction of movement and the overall unique design, making the equipment space is fully utilized to a relatively small size of equipment to achieve large area PCB rework, the maximum clamping plate size up to 1200*900mm, no rework dead ends;

● Suction rod with manual flow cool down system,on BGA reworking process,it can cool down chip surface at any time.It will decrease temperature difference,efficiently protect chip avoid to damage by high temperature;

● With solid-state operation display, make temperature more safe and reliable; Match side camera which can observe the side ball melting , easy to determine the curve.(this function is optional)

● High sensitive touch screen IPC control,intelligent operation system. It is canremote-control after networking.

● Built-in vacuum pump, Φ-axis arbitrary rotation, high-precision stepper motor control,automatic memory function, precision fine-tune nozzle;

● Suction nozzle automatically identify suction and placement height, the pressure can be controlled in the small range of 10 grams, with 0 pressure suction, placement function, for smaller chips;the suction rod with flow function,on heating process,it will cooling BGA surface,will reduce the temperature difference between BGA surface and solder ball position,can protect the chip avoid to damage by high temperature;

● Color high-definition optical system,with color-difference resolution, auto focus,software operating functions, 22x optical zoom, rework Maximum BGA size 120 *120mm; IPC+PLC control,embedded IPC,touch screen operation interface. PLC control,display temperature curve immediately,show setting curve and measured curve,can analyze the measured temperature curve.

● Heat and mount head design 2 in 1,which can auto rotate,mount,soldering and auto remove function;

● Up hot air head use two channel heating system,air outlet diameter is 80mm,when rework big size motherboard,temperature heating very fast,temperature uniformity and cooling fast(temperature can down at one time50-80degree),which can meet the requirement of the lead free chip rework process.Down temperature use infrared&hot air heating.IR directly heating on the heating area,together heating with the hot air,this can make PCB heating up very fast(speed can reach 10°C/S),the temperature can keep uniformity at same time;

● Large bottom preheater zone,adopt good quality dark infrared heating panel which import from Germany,temperature heating up fast,preheating uniformity,preheating area of 720*600 mm.When reworking large size PCB,the system with preheating advanced function.When open the machine,the infrared area will preheating the PCB firstly.Once PCB reach the setting trigger temperature,up and lower hot air start to heating.Preheat the PCB firstly,this is better to reduce the heat loss when PCB absorption of heating,solder ball can reach the melting temperature faster,avoid to change PCB shape efficiency,increase repair success rate.

● 10sections up(down) temperature+10sections constant temperature,can store more than 5000group temperature curve,can analysis the temperature curve on the touch screen; different sizes Titanium alloy nozzles,easy change,can 360°rotate.

●. 13 pcs temperature sensor, can monitor and analysis more place on the PCB. Equipped with nitrogen inlet, use nitrogen to protect the soldering,more the rework more safety and reliable.

Product packaging

Why Choose Us

● We are manufacturer = own factory+ machine design+sheet metal produced by ourselves+spray the powder+ strong assemble the machine team + packaging+free training ● Rich experience in BGA rework station field ● Develop new products to meet different requirements based on customer feedback ● Provide OEM services ● 100% NEW from WDS factory ● Have excellent teams and focus on product development & design, quality control & inspection ● Good reputation both at home and abroad

● Provide the spare parts for free whtin 1 year,lifetime technical support,online training or free field training

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