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PS2 PS3 Mobile IC Removal Machine 0.8mm-8mm Laptop Motherboard Repair Reballing

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Address: Building 7, No. 6, West Industrial Zone, Hosi, Xihuan Road, Shajing Street, Baoan District, Shenzhen, Guangdong

Contact name:Jack Du

Shenzhen Wisdomshow Technology Co.,ltd

PS2 PS3 Mobile IC Removal Machine 0.8mm-8mm Laptop Motherboard Repair Reballing

Country/Region	china
City & Province	shenzhen guangdong
Categories	Rubber Product Making Machinery Parts

Product Details

WDS-750 optical alignment iphone ic remove machine for XBOX PS2 PS3 Wii X360 laptop motherboard repair reballing

Details Picture optical alignment iphone ic remove machine:

Touch screen with human interface,heating time,heating temperature,reflow temperature rate,advanced alarming,vacuum time all can set inside the touch screen,simple operation,easy learn.BGA repair machine IR6000 optical alignment bga rework station iphone icloud remove machine
PLC import from Japan,temperature control module use China famous brand,display three temperature curves,4pcs independent temperature sensor,which can measure the different place temperature of the chips,make sure the rework rate bga station for iphone
Three independent heating temperature zone,each heating temperature zone can independently set the heating temperature ,heating time,rate;six heating temperature sections,Simulate the reflow oven heating mode[preheating,constant,warming,soldering,reflow soldering,cooling]
Auto feed chips,pick up chips,blowing chips;auto recognition chips place during alignment Multifunction mode [weld,remove,mount,manual],realize semi auto and auto function ,meet customer’s requirement

High precision K-type Closed Loop import from USA together with our company special heating way,the soldering rang of temperature within±1℃
Imported optical alignment system with 15’’high definition monitor;high precision micrometer adjust X/Y/R axis;make sure the alignment precision within 0.01-0.02mm.
Top heater and mounting heater design2 in 1 which can make the mounting more precision;there are many sizes of BGA nozzles which can meet different chips sizes,BGA nozzles can easy change,we accept customize.
High automatic and precision,Completely avoid human operation error; it is good for reworking lead free craft and double BGA,QFN,QFP,capacitance-type resistor components which can achieve good result. pcb soldering machine iphone
Additional monitoring camera which can observe the solder ball melting and easy to check the temperature curve and the soldering result(optional function) BGA repair machine IR6000

Specifications of WDS-750 BGA Chips Reballing Machine optical alignment iphone ic remove machine

power	6800W
Up heater power	1200W
Down heater power	1200W
IR heater power	4200W(2400W control)
Power supply	(Single Phase) AC 220V±10 50Hz
Position way	Optical lens+ Vshape holder+laser positioning
Temperature control	High precision K shape sensor(Closed Loop),up and down,independent,temperature,heating zone,Precision can reach±1℃
Material	High sensitive touch screen+temperature control module+PLC+step drive
PCB Size	Max:500×450mm , Min: 10×10mm
Thermo-couple Ports	4pcs
Chips magnification times	2-30
PCB thickness	0.5-8mm
BGA size	0.8mm-8cm
Min.chips pitch	0.15mm
Mounting BGA weight	1000G
Mounting precision	±0.01mm
Size	L670×W780×H850mm
Optical alignment lens	Motor drive can move front back right left
Weight	About 90kg

Company certificates

Our BGA Rework Station/ BGA reballing station are widely used to replace and repair the BGA chip in laptop, mobile phone, xbox360,ps3,etc.
The main user is repairing shops and factory to provide the after-sales service and rework.

How to separate BGA chip from motherboard?
How to replace a new BGA chip?

Repair steps:
1)      Separate the BGA chip from mother board –we called desoldering
2)      Clean Pad
3)      Reballing or replace a new BGA chip directly
4)      Alignment/Positioning – Depend on experience ,silk frame ,optical camera
5)      replace a new BGA chip - we called Soldering

Why WDS?

1. We are the Manufactuer = own factory+ machine design+Sheet metal produced by ourself +spray the powder+ strong assemble the machine team + packaging+free training;

2. Logo/Brand:Customer's designs and logos are welcome,we can silk-print your own logo company;

3. HUAWEI,TCL,ZTE,MEIZU,KONKA,LENOVO,FOXCONN vendor;

4. Have good market in Korea,Japan,NorthAfrica,Vietnam,Brazil,Turkey,India,Mexico and South Asia,The Mid-East and European countries;

5. 100% NEW from WDS factory;

6. Over 20 R&D engineers, with 10 year experience;

7. Over 100000 Global User;

8. All models approved CE ISO9001;

9. 100% QC inspect before shipment;

10. High quality & competitive price.