PCBA Unicomp X Ray Machine AX7900 High Resolution FPD For BGA Die Bond Wire Inspection

PCBA X-Ray machine Unicomp AX7900 with high resolution FPD for BGA void IC die bond wire inspection
 

Description of IC Xray machine AX7900:
 

90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm x 420mm , max. detection area 380 x 380mm, with ~300X System Magnification.
 
 
FEATURES of IC Xray machine AX7900:
 

1. 90KV 5μm X-ray tube, FPD Detector.
2. Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option).
3. Motion controls include: X/Y table motion plus Z axis tube and detector movement, ±60° tilt motion (option).
4. Multi-function DXI image processing system.
5. X/Y programming function for multiple image inspection routines
6. Max. loading area 420mm x 420mm, max. detection area 380 x 380mm, with ~300X System Magnification.
7. BGA void/area auto-measurement plus report generation.

APPLICATION of IC Xray machine AX7900:

1. LED, SMT, BGA, CSP, Flip Chip Inspection.
2. Semiconductor, Packaging components, Battery Industry.
3. Electronic components, Auto parts, Photovoltaic Industry.
4. Aluminum Die Casting, Moulding Plastic.
5. Ceramics, Other Special Industries

Technical Specifications

 
 
Inspection Images of IC Xray machine AX7900: