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[China]
Trade Verify
Address: Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen
Contact name:James Lee
Unicomp Technology |
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Verified Suppliers
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Unicomp AX8500 X-ray inspection machine for SMT / EMS BGA LED CSP QFN soldering void measurement
Technical Parameters and Specifications
| System Summary | |
| Footprint | 1370(W)×1300(D)×1700(H)mm |
| Machine Weight | 1600 kg |
| Power Supply | AC 110~220V, 50/60Hz |
| Plywood Packing Size | 1750(W)×1500(D)×2000(H)mm |
| Packing Weight | 1800 kg |
| Power Consumption | 2.0 kW |
| X-Ray Tube | |
| Tube Type | Sealed |
| Max. Power | 25W |
| Voltage | 0~110kV (Adjustable) |
| Focus Spot Size | 5μm |
| Imaging System | |
| Detector | Flat Panel Detector (FPD) |
| Pixel Size | 85μm |
| Effective Detection Area | 130*130mm |
| Frame Rates | 20fps |
| Pixel Matrix | 1536*1536 |
| System Magnification | 1600X |
| Software | |
| Auto-measuring | BGA Soldering Voids Auto-measuring and Support Data/Graphic Output |
| Multiple Measuring Tools | Support Measuring Distance, Angle, Diameter, Polygon, PTH filling rate, etc. |
| CNC Mode | CNC Programmable Inspection, Easy Operation and User Friendly |
| Real-time Display | Real-time Displaying the Working Data of Voltage, Current, Angle, Date, etc |
| Navigation | Convenient Target Point Positioning System |
| Motion Control System | |
| Movement Control | Joystick, Keypad & Mouse |
| Max. Loading Area/Weight | Ф570mm / 10kg |
| Max. Inspection Area | 450*450mm |
| Oblique Views | Max. 55° Filting (FPD) / 360° Rotation (Table) |
| Manipulator | 6-axis with X1 / X2 / Y / Z1 / T (55°) /R (360°) |
| Industrial PC | |
| Monitor | 22’’ FHD LCD Display |
| System OS | Windows 10 64bit |
| Hard disk | 1TB |
| RAM | 8GB |
| CPU model | Intel i7 Processor |
| Other Features | |
| Energy Saving | X-Ray Auto-off when it's out of work over than 5 minutes |
| Safety Operation | Electromagnetic Interlock and warning Light |
| Authority Management | Password Management |
| X-Ray Safety | <1μSv/h (Meets All International Standards) |
| * Specifications are subject to change without notice, All trademarks are the property of the system maker. | |
Inspection Images:
Functions and Features
Applications:
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB,
Semiconductor, Battery Industry, Small
Metal Casting, Electronic Connector Module, Cables,Aerospace
Components, Photovoltaic Industry, etc.
