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[China]
Trade Verify
Address: Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen
Contact name:James Lee
Unicomp Technology |
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Verified Suppliers
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Fully automatic Inspection and Analysing Inline AXI LX2000 X-ray for BGA , QFN soldering void inspection one FPC
Technical Parameters and Specifications
| System Summary | |
| Footprint | 2595(W)×1392(D)×1992(H)mm |
| Machine Weight | 1900 kg (X-Ray) / 700kg (Conveyor) |
| Power Supply | AC 110~220V, 50/60Hz |
| Plywood Packing Size | 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) |
| Packing Weight | 2000kg (X-Ray) / 800kg (Conveyor) |
| Power Consumption | 3.5 kW |
| X-Ray Tube | |
| Tube Type | Sealed |
| Max. Power | 8W |
| Voltage | 0~90kV (Adjustable) |
| Focus Spot Size | 5μm |
| Imaging System | |
| Detector | Flat Panel Detector (FPD) |
| Pixel Size | 85μm |
| Effective Detection Area | 130*130mm |
| Frame Rates | 20fps |
| Pixel Matrix | 1536*1536 |
| System Magnification | 200X |
| Software | |
| Auto-measuring | Auto Inspection and Analysing for Ok & NG Components |
| CNC Mode | CNC Programmable Inspection, Easy Operation and User Friendly |
| Rework | Support Rework Database Management System |
| Data Connection | Support MES/ERP/SPC System |
| Navigation | Convenient Target Point Positioning System |
| Motion Control System | |
| Movement Control | Joystick, Keypad, Mouse & Touch Panel (PLC) |
| Adjustable Tunnel width | 80~350mm |
| Max. Inspection Sample | 400*350mm / 10kg |
| Min . Inspection Sample | 100*80mm |
| Manipulator | Auto Inline System |
| Industrial PC | |
| Monitor | 22’’ FHD LCD Display |
| System OS | Windows 10 64bit |
| Hard disk | 1TB |
| RAM | 8GB |
| CPU model | Intel i7 Processor |
| Other Features | |
| Energy Saving | X-Ray Auto-off when it's out of work over than 5 minutes |
| Safety Operation | Electromagnetic Interlock, Warning Light |
| Authority Management | Password Magnagement |
| X-Ray Safety | <1μSv/h (Meets All International Standards) |
| * Specifications are subject to change without notice, All trademarks are the property of the system maker. | |
Application
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB,
Semiconductor, Battery Industry, Small
Metal Casting, Electronic Connector Module, Cables,Aerospace
Components, Photovoltaic Industry, etc.
Functions and Features
inspection images
