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X-ray Inspection for Diamond core drill bit inner distance measurement by Unicomp AX8200B
Applications:
BGA , CSP , LED , Flip Chip , Semiconductor,
Battery Industry , Small Metal Casting,
Electronic Connector Module,
Aerospace Components , Photovoltaic Industry,
The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework operation. Supported by a powerful and easy to use software interface, the AX-8200 is capable of addressing small and large volume factory requirements. (Contact us for details)
Other Special Industries.
| Item | Definition | Specs |
| System Parameters | Size | 1080(L)X1180(W)X1730(H)mm |
| Weight | 1150kg | |
| Power | 220AC/50HZ | |
| Power Consumption | 0.8KW | |
| X-Ray Tube | Type | Closed |
| Max.Voltage | 90kv/100kv | |
| Max.Power | 8W | |
| Spot Size | 5μm | |
| X-Ray System | Intensifier | 4"Image Intensifier |
| Monitor | 22"LCD | |
| System Magnification | 600X | |
| Detection Region | Max.Loading Size | 510mm x 420mm |
| Max.Inspection Area | 435mm x 385mm | |
| X-Ray Leakage | <1μSv/h | |
Inspection Images:
Features:
● 100KV 5μm X-ray tube, image intensifier with 2 mega pixels CCD
camera.
● Motion controls include: ±60° tilt motion, X/Y table motion plus
Z axis tube and detector movement.
● Multi-function DXI image processing system
● X/Y programming function for multiple image inspection routines
● Max. loading area 510mm x 420mm, max. detection area 435 x 385mm
with ~300X System Magnification.
● BGA void/area auto-measurement plus report generation.
