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Laboratory Benchtop X Ray Machine for LED / Flip Chip / Semiconductor

Unicomp Technology

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[China] country

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Address: Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen

Contact name:James Lee

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Laboratory Benchtop X Ray Machine for LED / Flip Chip / Semiconductor

Country/Region china
City & Province shenzhen guangdong
Categories Rubber Product Making Machinery Parts
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Product Details

Laboratory Benchtop X Ray Machine for PCB , LED , Flip Chip , Semiconductor

 

 

ItemDefinitionSpecs
System ParametersSize750(L)x570(W)x890(H)mm
Weight300kg
Power220AC/50Hz
Power Consumption0.5kW
X-ray TubeTypeClosed
Max.Voltage100kV
Max.Power200μA
Spot Size5μm
DetectorIntensifierFPD
X-ray Coverage48mm x 54mm
Resolution208Lp/cm
Work StationMax.Loading Size200mm x 200mm
Max.Inspection Area200mm x 200mm
Oblique Angle Views360° rotary fixture (Optional)
X-ray Leakage<1μSv/h


 

 

OUR SERVICE

 

1.Your inquiry will be replied in 12 hours.

 

2.Original Manufacture to customers, with competitive price.

 

3.We provide one year warranty, free training and whole life technology support.

 

4.We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you, and will give you the tracking NO. after shipment.

 

5.Well-trained and Professional after-sales service team to support you.

 

6.Manual will package with machine . It will show you how to use machine step by step.

 

7.Items are only shipped after payment is received.

 

 

Full Automatic BGA Testing Procedures

 

1. A simple mouse click programming without the need for operator intervention on the component can detects each BGA automatically.

 

2. Automatic BGA test, accurately check the bridge, Welding, cold welding and void ratio of BGA.

 

3. Automatic BGA test repeatable test results in order to process control

 

4. The test results will be displayed on the screen and can be output to Excel to facilitate review and archiving

 

 

NC Programming

 

1.A simple mouse clicks operation write test procedures

 

2.The stage can be X, Y director positioning; X-ray tube and detector Z positioning.

 

3.Software setting voltage and current

 

4.Image settings: brightness, contrast, auto gain and exposure

 

5.The user can set the program switch pause time

 

6.Anti-collision system can meet the maximum tilt and observe objects

 

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