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5.0mmT High Durability Thermal Conductive Pads For Heat Pipe Thermal Solutions

Dongguan Ziitek Electronical Material and Technology Ltd.

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Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, Guangdong Province, China

Contact name:Dana

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Dongguan Ziitek Electronical Material and Technology Ltd.

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5.0mmT High Durability Thermal Conductive Pads For Heat Pipe Thermal Solutions

Country/Region china
City & Province dongguan guangdong
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Product Details

5.0mmT High Durability Conductive Pads for Heat Pipe Thermal Solutions

 

Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

 

TIF100N-40-10F-Specification-sheet.pdf

 

Ziitek TIF1200N-40-10F​ is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.


 

<Good thermal conductive: 4.0 W/mK
<Thickness: 5.0mmT
<Hardness:55±5 Shore 00
<Colour: gray

<Naturally tacky needing no further adhesive coating
<Available in varies thicknesses
<Broad range of hardnesses available

 

 

 

 

Applications

<mainboard/mother board

<notebook

<power supply

<Heat pipe thermal solutions

<Memory Modules

<Mass storage devices

 

 
Typical Properties of TIF1200N-40-10F
 
Product NameTIF1200N-40-10F Series
ColourGray
Construction & CompostionCeramic filled silicone elastomer
Specific gravity

2.1 g/cm^3

Thickness5.0mmT
Hardness55±5 Shore 00
Dielectric constant@1MHz4.7 MHz
Continuos Use Temp-40 to 160℃
Dielectric Breakdown Voltage>5500 VAC
Thermal conductivity4.0W/mK
Volume Resistivity1.0*1012 Ohm-cm

 
 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

 

 

 
 

Independent R&D team

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online.

 


 
FAQ

Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

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